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High Purity Titanium-Molybdenum TiMo Sputtering Target Customized

Element Symbol:Titanium-Molybdenum TiMo
CAS:[N/A]
Model:Sup-TiMo
Purity:3N5
Shape:Round,Square
Thickness:[N/A]
Dimension:[N/A]
(Note: Purity, shape, thickness, and dimensions can all be customized)

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TiMo Target Product Details

Titanium-Molybdenum (Ti-Mo) targets are sputtering target composed of a titanium and molybdenum alloy, with the compositional ratio adjustable to optimize film properties for specific applications.  The alloy combines the lightweight nature, high strength, and excellent corrosion resistance of titanium with the high melting point, high hardness, and good electrical conductivity of molybdenum. 

Note: Purity, shape, thickness, and dimensions can all be customized,Please feel free to contact us for more details.

Purity (%)ShapeManufacturing processMax. Size
99.95%

Plane target, Cylindrical target,

 Arc target, Custom-shaped target

Vacuum Melting,PMCustomized

This results in a material with several advantageous characteristics:

- Physical Properties: High melting point (dependent on alloy ratio, typically exceeding 1400°C), high strength, good ductility (dependent on ratio and processing), high hardness, and low coefficient of thermal expansion.  Density falls between that of pure titanium and molybdenum, depending on the exact composition.

- Chemical Properties: Excellent corrosion resistance, particularly in reducing atmospheres.  Good resistance to most acids and alkalis, although susceptibility to strong oxidizing agents should be considered.  Readily forms a passive oxide layer further enhancing corrosion resistance.

- Mechanical Properties: High strength and good toughness allow it to withstand stresses during sputtering, extending target lifetime.  Relatively good wear resistance.

- Electrical Properties: Good electrical conductivity leads to deposited films with excellent conductive properties, suitable for electronic applications.

Applications:

Ti-Mo sputtering targets are widely used in various thin-film deposition techniques, including magnetron sputtering, DC sputtering, and RF sputtering, primarily for:

- Semiconductor Industry: Deposition of highly conductive, low-resistivity films for interconnects, electrodes, etc.; fabrication of films with specific electrical properties, such as metallization layers in integrated circuits.

- Optics: Deposition of films with high reflectivity or specific optical properties for optical component coatings.

- Decorative Coatings: Deposition of hard, wear-resistant, and aesthetically pleasing decorative films.

- Biomedical Applications: Deposition of biocompatible films for biomedical implants.

- Other Applications:  For example, in aerospace for high-temperature, corrosion-resistant components.

To receive a prompt quotation and expedited delivery, please provide complete target material specifications. This includes details on purity, dimensions, tolerance requirements, and any other technical specifications.

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