Element Symbol:Nckel (Ni)
CAS:[N/A]
Model:Sup-Ni
Purity:4N、3N5、3N
Shape:Round
Thickness:[N/A]
Dimension:[N/A]
(Note: Purity, shape, thickness, and dimensions can all be customized)
Nickel Target Product Details:
Nickel is a silvery-white metallic element known for its good ductility, toughness, and high melting point. In industry, nickel is commonly used in alloy production, battery manufacturing, and as a catalyst. Particularly in the target material field, nickel is widely used due to its excellent physical and chemical properties. Targets are materials used as a source for sputtering or evaporation in processes like physical vapor deposition (PVD).
Note: Purity, shape, thickness, and dimensions can all be customized,Please feel free to contact us for more details.
Purity (%) | Shape | Manufacturing process | Max. Size |
99.9%, 99.95%, 99.99% | Plane target, Cylindrical target, Arc target, Custom-shaped target | Vacuum Melting | Customized |
To receive a prompt quotation and expedited delivery, please provide complete target material specifications. This includes details on purity, dimensions, tolerance requirements, and any other technical specifications.
Preparation Methods
1. Sputtering Method
- DC Sputtering: Used for non-insulating materials like nickel. A voltage difference is created between the target and the substrate by a DC power supply, driving nickel atoms to sputter from the target surface onto the substrate.
- RF Sputtering: Suitable for insulating or high-resistance materials. RF sputtering generates a radio frequency electric field between the target and the substrate, exciting gas to create plasma, which facilitates nickel atom deposition.
2. Electron Beam Evaporation
- In a vacuum environment, a high-energy electron beam strikes the nickel target, energizing nickel atoms on the surface to evaporate and condense on the substrate, forming a thin film.
3. Chemical Vapor Deposition (CVD)
- This method deposits nickel on the substrate surface at high temperatures through chemical reactions. It requires volatile nickel compounds as reactants. By precisely controlling reaction conditions, high-purity and uniform nickel films can be obtained.
4. Hot Pressing
- Nickel powder is compressed under high temperature and pressure to form targets, typically used to produce high-purity and high-density nickel targets. This method allows control over the microstructure of the nickel targets, enhancing their physical properties.
5. Electrolytic Method
- This method directly deposits nickel onto the substrate from a nickel salt solution through an electrolytic process. It can produce large-area nickel targets at low cost.
6. Magnetron Sputtering
- By incorporating a magnetic field to control the trajectory of sputtered particles, this method improves the deposition efficiency of nickel targets and the uniformity of the film layers.
Applications of Nickel Targets
Nickel sputtering targets are used in thin film deposition, decoration, semiconductors, displays, LEDs, photovoltaic devices, and functional coatings. They show good application prospects in industries such as optical information storage, automotive glass, architectural glass, and optical communications.
Other applications of nickel include its use in manufacturing stainless steel, coins, and batteries. When evaporated in a vacuum, nickel can form decorative coatings on ceramic surfaces or serve as a solder layer in circuit device manufacturing. It is frequently sputtered to form layers in magnetic storage media, fuel cells, and sensors.
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Tel: +86-18059149998
Email: sales@supsemi.com
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