Element Symbol:SiC
CAS:409-21-2
Model:Sup-SiC
Shape:Wafer, Disc or ingot
Thickness:[N/A]
Dimension:[N/A]
(Note: Purity, shape, thickness, and dimensions can all be customized)
Silicon Carbide (SiC) is an important semiconductor material widely used in high-temperature, high-power, and high-frequency electronic devices. It is composed of silicon and carbon elements and possesses very high thermal conductivity and chemical stability. Due to its excellent electrical properties and wear resistance, silicon carbide is extensively applied in optoelectronics, power electronics, automotive electronics, and energy sectors.
Note: Purity, shape, thickness, and dimensions can all be customized,Please feel free to contact us for more details.
Main performance parameters | |||
Growth method | Seed crystal sublimation method, PVT (Physical gas phase transfer) | ||
Crystal structure | Hexagon | ||
Lattice constant | a=3.08 Å ,c=15.08 Å | ||
Marshalling sequence | ABCACB(6H), ABCBABCB(4H) | ||
Band gap | 2.93 eV | ||
Mohs hardness | 9.2 | ||
Heat conductivity @300K | 5 W/ cm.k | ||
Dielectric constant | e(11)=e(22)=9.66 e(33)=10.33 | ||
Conductor type | I | N | |
Dopant | Undoped | Vanadium | Nitrogen |
Resistivity (ohm.cm) | ˃ 1*107 | ˃ 1*105 | 0.01-0.2 |
Dimension | 5x5,10x10,15x15,20x20, | ||
Ø50.8, Ø100 mm, Ø150mm等 | |||
Thickness | 0.33/0.35/0.5mm, Special direction and size of the substrate can be customized according to the customer need | ||
Polishing | One side or two sides | ||
Orientation | <0001>or <0001> off 4.0º | ||
Orientation tolerance | ±0.5° | ||
Flat orientation tolerance | 2°(special requirements 1°) | ||
Roughness | ≤5Å(5µm×5µm) | ||
Packing | Class 100 clean bag, Class 1000 clean room |
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Contact: Bruce Liu
WhatsApp: +86-18059149998
Tel: +86-18059149998
Email: sales@supsemi.com
Add: Room 1402, Building 1, No. 89 Xibeilu, Xishancun, Xibei Street, Xinluo District, Longyan City, Fujian Province
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