Why is higher purity better for CMP polishing particles?

The purity of CMP (Chemical Mechanical Planarization) polishing particles affects their performance and product quality. 

Higher purity CMP particles generally offer several advantages:

1. Reduced Impurity Interference: High-purity CMP particles contain fewer impurities, which can impact the material removal rate, uniformity, and surface quality during the polishing process. Impurities may react chemically with the material being polished, leading to undesirable surface defects or scratches.

2. Increased Stability: High-purity materials are easier to control in terms of their chemical and physical properties during processing. This helps maintain consistency in the polishing process, ensuring that the relative effects of each treatment remain the same.

3. Optimized Chemical Reactions: In CMP, the interaction between particles and chemical agents is crucial. High-purity particles react more predictably with chemical agents, helping to improve removal rates and reduce the formation of residues.

4. Improved Removal Rates: High-purity CMP particles typically achieve higher removal rates when polishing materials like silicon and metals due to their superior wear characteristics. Effective removal rates are essential for manufacturing advanced semiconductors and electronic devices.

5. Enhanced Surface Quality: High-purity polishing particles can effectively reduce scratches and defects during the polishing process, resulting in a smooth and flat surface that improves the effectiveness of subsequent treatments.

Therefore, in CMP applications, selecting high-purity polishing particles can enhance overall processing performance and the quality of the final product, which is particularly important in high-precision fields like semiconductor manufacturing.

Supsemi offers a variety of precision CMP (Chemical Mechanical Planarization) solutions suitable for use in universities, research institutes, and corporate laboratories. Super flat stainless steel polishing plate (RMS: Flatness < 0.25 micron / inch²). High precision rotating plate run-off < 5 microns. Please feel free to contact us for more details.