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  • SYJ-3310型精密划片机
SYJ-3310型精密划片机

SYJ-3310型精密划片机

产品名称:12英寸高精度硅片切割锯

产品型号:SYJ-3310

产品描述:适用于12英寸硅片、LED封装、QFN、DNF、BGA、光学和光电子器件、通信、PCB、陶瓷、玻璃、铌酸锂、氧化铝、石英等。加工尺寸:Φ12或280mm。槽深:≤4mm或可定制。

产品描述

UV系列粘合剂去除剂专为切割后剥离与UV薄膜粘合的产品而设计,如晶片、QFN、玻璃、基板、移动模块和陶瓷。该系列采用LED冷光源,具有可编辑控制器和全彩触摸屏作为操作系统,增强了设备性能的稳定性,使操作更加方便。


产品特征

1.大尺寸切割加工,最大加工尺寸为φ12。

2.配备进口气动主轴和标准2.4KW高扭矩主轴。

3.可选非接触式高度测量(NCS)。

4.可选刀片破损检测(BBD)。

5.θ轴采用直驱DD电机,精度高,速度快。

6.两套高倍率和低倍率显微镜系统可实现高速图像识别、多种对齐模式和快速边缘查找,显著提高效率。


产品参数


Product Name
High-Precision Wafer Dicing Saw for 12-Inch Wafers QFN quartz etc
Product ModelSYJ-3310
Product Applications12-inch silicon wafers, LED packaging, QFN, DNF, BGA, optical and optoelectronic devices, communication, PCB, ceramics, glass, lithium niobate, alumina, quartz.
Configuration PerformanceProcessing SizeΦ12 or 280mm
Groove Depth≦4mm or customizable
SpindleSpeed6000~60000rpm
Output PowerDC, 2.4KW
X-axisCutting StrokeMAX280mm
Speed Setting Range0.1~500mm/s
Y-axisCutting Stroke Max280mm
Single Step Accuracy≦0.003mm/5mm
Maximum Overall Error≦0.005mm/280mm
Z-axisEffective StrokeMax40mm
Repeatability Accuracy0.001mm
Tool Application Sizeφ50mm~φ60mm
θ-axisAngle Range  320°
Resolution0.0002°
Alignment SystemLight Source + Ring Light Industrial Camera
Display MonitorIndustrial-grade 15" Color LCD Touchscreen



SubjectParameters

Operating 

System

Control SystemPC Base+Windows
Operating SystemWindows Language: English / 中文 (Chinese)

Usage 

Conditions 

Power SupplySingle-phase, AC 380±5%, 4.0kVY
Compressed Air

Pressure: 0.5–0.6Mpa, Maximum Consumption: 260L/min  

Cutting Fluid 

Pressure: 0.2–0.3Mpa, Maximum Consumption: 4.0L/min 

Cooling Water

Pressure: 0.2–0.3Mpa, Maximum Consumption: 1.5L/min 

Exhaust Volume 

5.0m³/min (ANR) 

Ambient Temperature 

20–25°C 

Humidity

<80%

1. Please set the machine in an environment of 20-25°C (with fluctuations controlled within ±1°C); indoor humidity should be <80% and free from condensation.  

2. Please use clean compressed air with an atmospheric pressure dew point below -15°C, residual oil content of 0.1ppm, and a filtration level of 0.01um/99.5 or higher.  

3. Please control the temperature of the cutting fluid to room temperature +2°C (with fluctuations within ±1°C), and the cooling water temperature should match room temperature (with fluctuations controlled within ±1°C).  

4. Please avoid subjecting the equipment to gravitational impacts or any external vibration threats. Additionally, do not place the equipment near blowers, ventilation openings, high-temperature devices, or sources of oil contamination.  

5. Install the equipment on a waterproof floor and in a location with smooth drainage.


Installation 

Parameters

Overall Dimensions W × D × H910mm×1100mm×1860mm 
Weight1500kg


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