产品名称:12英寸高精度硅片切割锯
产品型号:SYJ-3310
产品描述:适用于12英寸硅片、LED封装、QFN、DNF、BGA、光学和光电子器件、通信、PCB、陶瓷、玻璃、铌酸锂、氧化铝、石英等。加工尺寸:Φ12或280mm。槽深:≤4mm或可定制。
产品描述
UV系列粘合剂去除剂专为切割后剥离与UV薄膜粘合的产品而设计,如晶片、QFN、玻璃、基板、移动模块和陶瓷。该系列采用LED冷光源,具有可编辑控制器和全彩触摸屏作为操作系统,增强了设备性能的稳定性,使操作更加方便。
产品特征
1.大尺寸切割加工,最大加工尺寸为φ12。
2.配备进口气动主轴和标准2.4KW高扭矩主轴。
3.可选非接触式高度测量(NCS)。
4.可选刀片破损检测(BBD)。
5.θ轴采用直驱DD电机,精度高,速度快。
6.两套高倍率和低倍率显微镜系统可实现高速图像识别、多种对齐模式和快速边缘查找,显著提高效率。
产品参数
Product Name | High-Precision Wafer Dicing Saw for 12-Inch Wafers QFN quartz etc | |
Product Model | SYJ-3310 | |
Product Applications | 12-inch silicon wafers, LED packaging, QFN, DNF, BGA, optical and optoelectronic devices, communication, PCB, ceramics, glass, lithium niobate, alumina, quartz. | |
Configuration Performance | Processing Size | Φ12 or 280mm |
Groove Depth | ≦4mm or customizable | |
Spindle | Speed | 6000~60000rpm |
Output Power | DC, 2.4KW | |
X-axis | Cutting Stroke | MAX280mm |
Speed Setting Range | 0.1~500mm/s | |
Y-axis | Cutting Stroke | Max280mm |
Single Step Accuracy | ≦0.003mm/5mm | |
Maximum Overall Error | ≦0.005mm/280mm | |
Z-axis | Effective Stroke | Max40mm |
Repeatability Accuracy | 0.001mm | |
Tool Application Size | φ50mm~φ60mm | |
θ-axis | Angle Range | 320° |
Resolution | 0.0002° | |
Alignment System | Light Source + Ring Light Industrial Camera | |
Display Monitor | Industrial-grade 15" Color LCD Touchscreen |
Subject | Parameters | |
Operating System | Control System | PC Base+Windows |
Operating System | Windows Language: English / 中文 (Chinese) | |
Usage Conditions | Power Supply | Single-phase, AC 380±5%, 4.0kVY |
Compressed Air | Pressure: 0.5–0.6Mpa, Maximum Consumption: 260L/min | |
Cutting Fluid | Pressure: 0.2–0.3Mpa, Maximum Consumption: 4.0L/min | |
Cooling Water | Pressure: 0.2–0.3Mpa, Maximum Consumption: 1.5L/min | |
Exhaust Volume | 5.0m³/min (ANR) | |
Ambient Temperature | 20–25°C | |
Humidity | <80% | |
1. Please set the machine in an environment of 20-25°C (with fluctuations controlled within ±1°C); indoor humidity should be <80% and free from condensation. 2. Please use clean compressed air with an atmospheric pressure dew point below -15°C, residual oil content of 0.1ppm, and a filtration level of 0.01um/99.5 or higher. 3. Please control the temperature of the cutting fluid to room temperature +2°C (with fluctuations within ±1°C), and the cooling water temperature should match room temperature (with fluctuations controlled within ±1°C). 4. Please avoid subjecting the equipment to gravitational impacts or any external vibration threats. Additionally, do not place the equipment near blowers, ventilation openings, high-temperature devices, or sources of oil contamination. 5. Install the equipment on a waterproof floor and in a location with smooth drainage. | ||
Installation Parameters | Overall Dimensions W × D × H | 910mm×1100mm×1860mm |
Weight | 1500kg |
联系人:Bruce Liu
手机:+86-18059149998
电话:+86-18059149998
邮箱:sales@supsemi.com
地址: 福建省龙岩市新罗区西陂街道西山村西陂路89号1幢1402室
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