Wafer chip Film Transfer Equipment Machine for Semiconductor Lab Reasearch

The wafer chip film transfer machine is a device used to transfer a wafer with an applied film to another adhesive film. It is typically utilized in the semiconductor manufacturing process for chip packaging and post-packaging equipment assembly. 

This machine is designed to replace the existing film on the chip with a new adhesive film, serving as equipment for adhesive film transfer during wafer fabrication.

Uses of Chip Film Transfer Machine:

Packaging: In the packaging process of chip manufacturing, the chip film transfer machine can place a wafer containing completed chips onto a packaging layer (typically adhesive or packaging material). This protects the chips and provides electrical and mechanical connections.

Film Transfer: The chip film transfer machine can be used to transfer a wafer from one film to another (e.g., UV film, blue film, optical film, etc.). This can be used to manufacture devices with specific functions, such as optical devices, sensors, and microelectronic components.

Flip Packaging: In some advanced packaging technologies, the chip film transfer machine can be used to invert the chip and package it at specific locations on another film. This method can achieve cleaner products, thereby enhancing chip performance.

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