Wafer UV Film De-bonding Machine Glue Resin Adhesive Removal Equipment System for Semiconductor Lab

In the production process, when using a conventional de-bonding machine, the curing time for UV adhesives typically takes 30-40 seconds, resulting in a long de-bonding duration. 

However, with the new generation of SUPSEMI LED UV de-bonding machines, the adhesive properties of the film and the chemical reaction with UV wavelengths accelerate the reaction, reducing the curing time.Therefore, this system is highly applicable, offering fast de-bonding speeds, making it suitable for both research and mass production.

Applications of UV De-bonding Machine：Suitable for the de-bonding of UV films on semiconductor materials such as optical lenses, LEDs, ICs, semiconductors, wafer chips, integrated circuit boards, and mobile hard drives.

Features:

1. Wafer Size: Compatible with 4-inch, 5-inch, 6-inch, 8-inch, and 12-inch wafers, with customization available for other sizes.

2. User Operation: The operator only needs to simply place or remove the workpiece; all other operations are fully automatic.

3. Compact Design: The machine has a compact design with a drawer-style push-pull door for easy operation.

4. Customizable Fixtures: Comes with user-required jigs and clamps.

5. Irradiation Method: Bottom-up irradiation.

6. LED UV Light Source: Utilizes imported LED UV light sources that are low-temperature, environmentally friendly, noiseless, and radiation-free, providing uniform exposure, compact structure, and low energy consumption, making it an ideal model for the semiconductor industry.

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