Shipped to Japan Wafer Chip Film Transfer Machine and UV De-bonding Machine

We are excited to announce the successful shipment of our state-of-the-art Wafer Chip Film Transfer Machines and UV De-bonding Machines to Japan. This shipment marks an important step in supporting the growing semiconductor industry in the region. We would like to express our special thanks to Dr. Naoki for his trust and support at the same time！

Details of the Shipment

- Date of Shipment: 2024-11-18

- Destination: Japan

- Equipment Included:

- Wafer Chip Film Transfer Machines

  - UV De-bonding Machine

These machines are designed to enhance production efficiency and improve the quality of semiconductor manufacturing processes. 

Benefits of Our Machines

1. High Precision: Ensures accurate film transfer for better chip performance.

2. Efficient De-bonding: The UV De-bonding Machine effectively removes temporary adhesives without damaging the wafer.

3. User-Friendly: Both machines are designed for easy operation, facilitating quick integration into existing production lines.

We are proud to contribute to the advancement of semiconductor technology in Japan with our innovative machines. We look forward to seeing the positive impact they will have on production processes. 

If you need semiconductor equipment or research materials and Consumables, please Contact us for detailed product information.