12 inches 300mm Square Wafer Frame Ring, Suitable for Semiconductor Packaging and Film Lamination

Electronic silicon wafer iron rings are customized according to customer requirements. They are processed by laser cutting, polishing, and surface drilling and polishing. The electronic silicon wafer iron rings have high flatness and are more stable in fixing products, without any deviation or displacement issues. 

Product Number: DSMTQJ12-000-R0

Material: 3CR13 High Alloy Steel

The size of wafer frame(can be customized according to customer production requirements):

SUPSEMI has 11 years of experience in semiconductor turnover storage vehicle production and high-quality upstream and downstream supplier channel management. The electronic silicon wafer iron rings produced by SUPSEMI are sturdy and durable, with guaranteed quality, and can be customized according to customer production requirements.

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