Wafer Dicing Carrier Tray Boat for Semiconductor Wafer Handling, Transport  in Die Saw Applications

6-inch DIE SAW processing tray parameters:

Note:Non standard customization can be carried out according to customer requirements.

Product Code: DSF20K06-000-R0

Material: 6061 aluminum profile

Weight ≈ 1.9 kg

Starting position: 12.5 mm

Oxidation process: surface anodic sandblasting treatment

Flatness ≤ 0.05mm

Product specifications: 215 * 212 * 146mm (25 slots); 

Slot width 207mm; 

Packaging method: cardboard box+wooden frame packaging

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