Welcome: Supsemi Electronic Technology Co., Ltd
sales@supsemi.com
+86-18059149998
Brand: SupSemi
Model: SUP-MX200 、SUP-MX300
Description: Button-Controlled UV De-bonding Machine for Wafer Adhesive Removal
Parameters | |||
| Product Model | SUP-MX200 、SUP-MX300 | Power | 650W(SUP-MX200)/ 950W(SUP-MX300) |
| Operating Voltage | AC 220V, 50Hz (110V optional) | Control Method | Button control |
| Lifespan | >20,000 hours | Storage Environment | 15°C - 25°C |
| Operating Environment | -10°C - 50°C | UV Intensity | >400 mW/cm² |
| Emission Angle | 60 degrees | Emission Area | 310mm × 310mm |
| Single Lamp Power | 3W | Compatible Wafer Sizes | 6-inch/ 8-inch/10-inch/12-inch |
| Wavelength | 365nm | ||
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Exhibition
Contact: Bruce Liu
WhatsApp: +86-18059149998
Tel: +86-18059149998
Email: sales@supsemi.com
Add: Room 1402, Building 1, No. 89 Xibeilu, Xishancun, Xibei Street, Xinluo District, Longyan City, Fujian Province
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