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Triple-Target Magnetron Sputtering System for Lab Thin Film

Product Name: Triple-Target Magnetron Sputtering System for Lab Thin Film

Product Model: SUP-600-3HD-1000

Product Description: The VTC-600-3HD-1000 triple-target magnetron sputtering system is a high-vacuum coating device independently developed by our company.

It can be used to prepare single-layer or multi-layer ferroelectric films, conductive films, alloy films, semiconductor films, ceramic films, dielectric films, optical films, oxide films, hard films, and polytetrafluoroethylene films, among others.

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Product Description

The VTC-600-3HD-1000 triple-target Magnetron Sputtering System is equipped with three target guns and three power supplies: one radio frequency power supply for sputtering non-conductive materials and one direct current power supply for sputtering conductive materials. An optional strong magnetic target is available for sputtering ferromagnetic materials. 

Compared to similar devices, it has the advantages of a compact size for easy operation and a wide range of usable materials, making it an ideal device for laboratory preparation of various types of thin films.


Product Features

1. Configured with three target guns: two paired with radio frequency power supplies for sputtering non-conductive target materials, and one paired with a direct current power supply for sputtering conductive materials.

2. Capable of preparing various thin films with wide applications.

3. Compact size and easy to operate.


Product Parameters

Product NameTriple-Target Magnetron Sputtering System for Lab Thin Film
Product ModelSUP-600-3HD-1000

Installation 

Requirements

This equipment is required to be used at a temperature of 25°C ± 15°C and a humidity of 55% RH ± 10% RH.

1. Water: The device is equipped with a self-circulating cooling water machine (fill with purified water or deionized water).

2. Electricity: AC 220V, 50Hz, with proper grounding required.

3. Gas: The equipment chamber must be filled with argon gas (purity of 99.99% or above). An argon gas cylinder (with a Ø6mm double ferrule connector) and a pressure regulator must be provided.

4. Worktable: Dimensions of 1500mm × 600mm × 700mm, with a load capacity of over 200kg.

5. Ventilation: A ventilation system is required.


Main 

Parameters

 1. Input power supply: 220V/50Hz  

2. Number of sputtering targets: 3  

3. Chamber inner diameter: Ø300mm  

4. Target gun cooling method: Water cooling  

5. Ultimate vacuum: 7.4E-5 Pa  

6. Vacuum chamber specifications: Φ300 × 330 mm  

7. Vacuum system: VRD-16 mechanical pump, FF-100/150 turbo molecular pump  

8. Vacuum recovery: System can be evacuated from atmospheric pressure to 5.0E-3 Pa in ≤30 min (short-term exposure to atmosphere)  

9. Gas charging system: 2 mass flow meters (1 for argon at 100 sccm, 1 for argon at 200 sccm); special gases can be customized  

10. Sputtering target specifications: Φ2", thickness 0.1-5mm (thickness may vary with different materials)  

11. Sample stage: Φ70mm, can be heated (room temperature to 1000℃)


Product 

specifications

Host dimensions: Width 900mm × Depth 650mm × Height 1100mm



Optional Accessories

Item No.Product NameQty
1

Various target materials such as gold, indium, silver, and platinum  

Optional
2

Optional strong magnetic target for sputtering ferromagnetic materials 

Optional
3

Masking plate

Optional
4

Vibrating sample stage

Optional
5Double-layer rotating coating fixture
Optional

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