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Small Dual-Target Magnetron Sputtering System Sputter Coater for Thin Films

Product Name: Small Lab Dual-Target Sputter Deposition System

Product Model: VTC-600-2HD

Product Description: The VTC-600-2HD dual-target magnetron sputtering system is a high-vacuum coating device that can be used to prepare single-layer or multi-layer films, including ferroelectric films, conductive films, alloy films, semiconductor films, ceramic films, dielectric films, optical films, oxide films, hard films, and polytetrafluoroethylene (PTFE) films.

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Product Description

The VTC-600-2HD dual-target Magnetron Sputtering System is equipped with two target guns and two power supplies: one RF power supply for sputtering non-conductive materials and one DC power supply for sputtering conductive materials. A strong magnetic target for sputtering ferromagnetic materials is also available as an option. 

Compared to similar equipment, it has the advantages of a compact size for ease of operation and a wide range of usable materials, making it an ideal device for laboratory preparation of various material films.


Product Features

1. Equipped with two target guns: one paired with an RF power supply for sputtering non-conductive targets, and the other paired with a DC power supply for sputtering conductive materials.  

2. Capable of preparing various films with a wide range of applications.  

3. Compact size and easy to operate.


Product Parameters

Product NameSmall Dual-Target Magnetron Sputtering System Sputter Coater for Thin Films
Product ModelVTC-600-2HD

Installation 

Requirements

This equipment is required to operate at a temperature of 25°C ± 15°C and a humidity of 55% RH ± 10% RH.

1. Water: The equipment is equipped with a self-circulating cooling water system (fill with purified water or deionized water).  

2. Power: AC 220V 50Hz, must have good grounding.  

3. Gas: The equipment chamber must be filled with argon gas (purity of 99.99% or higher); an argon gas cylinder (with a Ø6 mm double ferrule connector) and pressure regulator must be provided by the user.  

4. Workbench: Dimensions 1500 mm × 600 mm × 700 mm, with a load capacity of over 200 kg.  

5. Ventilation: Required.


Main 

Parameters

1. Power supply voltage: 220V 50Hz  

2. Power: 900W  

3. Chamber inner diameter: Ø300 mm  

4. Ultimate vacuum level: 9.0 × 10⁻⁴ Pa  

5. Sample stage heating temperature: RT - 500°C, accuracy ±1°C (temperature can be increased based on actual needs)  

6. Number of target guns: 2 (other quantities available upon request)  

7. Target gun cooling method: Water cooling  

8. Target material size: Ø2″, thickness 0.1-5 mm (thickness may vary depending on the target material)  

9. DC sputtering power: 500W; RF sputtering power: 300W. (Power supply types are selectable; can choose two DC power supplies, two RF power supplies, or one DC and one RF power supply)  

10. Sample stage: Ø140 mm, with optional bias function available based on customer needs for higher quality coating.  

11. Sample stage rotation speed: Adjustable within 1 rpm - 20 rpm  

12. Working gases: Inert gases such as Ar  

13. Inlet gas line: Mass flow meter controls two gas inlets, one at 100 SCCM and the other at 200 SCCM.

Product 

specifications

1. Main unit dimensions: 500 mm × 560 mm × 660 mm  

2. Overall dimensions: 1300 mm × 660 mm × 1200 mm  

3. Vacuum chamber specifications: φ300 × 300 mm  

4. Weight: 160 kg



Standard Accessories



Item No.Product Name
Qty
1

DC Power Supply Control System

1 set
2RF Power Supply Control System1 set
3

Film Thickness Monitoring System 

1 set
4

Molecular Pump (imported from Germany or 

domestic with greater pumping speed)  

1 unit
5Chiller1 unit
6Polyester PU Tube (Ø6 mm)4m



Optional Accessories

Item No.Product NameQty
1

Various target materials such as gold, indium, silver, and platinum  

Optional
2

Optional strong magnetic target for sputtering ferromagnetic materials 

Optional
3Double-layer rotating coating fixture
Optional

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