Small Triple-Target Plasma Sputter Coater Sputtering Machine for Thin Films

Small Triple-Target Plasma Sputter Coater Sputtering Machine for Thin Films

Product Name: Triple-Target Plasma Sputter Coater for Lab Research
Product Model: VTC-16-3HD

Product Description: The VTC-16-3HD triple-target plasma sputtering system can sputter three types of target materials: gold, silver, and copper. It cannot sputter light metals or carbon. This machine features a rotating sample stage, allowing for the sequential deposition of three thin films onto the same sample, making it suitable for preparing composite film samples in the laboratory.

Product Description

The VTC-16-3HD triple-target plasma sputtering system is a compact plasma film sputtering device (standard DC type) with a touchscreen control panel. The maximum substrate size is 2 inches, and the sample diameter is Ø50 mm, with a heating temperature reaching up to 500°C.

The VTC-16-3HD triple-target plasma sputtering system uses a PLC control panel for device management, making it easy and intuitive to operate. This compact equipment takes up minimal laboratory space and is user-friendly, allowing for a wide range of applications. As a result, it is widely used in laboratories at major universities and research institutions.

Product Features

1. PLC control panel with a 4.3″ touchscreen and PID temperature control method.

2. Controllable parameters include vacuum level, current, target position, and substrate heating temperature.

3. Can be used with a vacuum pump and stainless steel corrugated KFD25 quick-release clamp.

4. The system has also been CE certified.

Product Parameters

Product Name	Small Triple-Target Plasma Sputter Coater Sputtering Machine for Thin Films
Product Model	VTC-16-3HD
Installation Requirements	This equipment is required to operate at a temperature of 25°C ± 15°C and a humidity of 55% RH ± 10% RH. 1. Water: Not required 2. Power: AC 220V 50Hz, must have good grounding 3. Gas: The equipment chamber must be filled with argon gas (purity of 99.99% or higher); an argon gas cylinder (with pressure regulator) must be provided by the user 4. Workbench: Dimensions 600 mm × 600 mm × 700 mm, with a load capacity of over 50 kg 5. Ventilation: Not required
Main Parameters	1. Input power: Universal 110V/220V, 2000W (including vacuum pump) 2. Output power: 1600V DC, 50 mA (maximum current) 3. Quartz cover: Ø160 mm × 120 mm 4. Sample stage: Ø50 mm (optional heated sample stage, maximum temperature up to 500°C; sputtering time must not exceed 5 minutes) 5. Vacuum pump: 120 L/min rotary vane vacuum pump 6. Inlet: Equipped with a precision adjustable needle valve for convenient adjustment of the gas flow 7. Target material: Diameter Ø47 mm, thickness 0.1 mm - 3 mm; can sputter Au, Ag, Pt, Cr, Ni; cannot sputter oxides, semiconductors, some light metals, Al, Zn, C, etc.
Product specifications	dimensions：350mm×360mm×350mm Weight：50kg

Optional Accessories

Item No.	Product Name	Qty
1	KF25 vacuum flange and clamp	Optional
2	Stainless steel corrugated tube (600 mm)	Optional
3	Rotary vane vacuum pump (120 L/min)	Optional
4	Various high-purity metal targets such as platinum, silver, and zinc	Optional
5	Heated sample stage	Optional