High-Precision Grinder Polisher - CMP Equipment for Wafer Grinding and Polishing in Semiconductor Labs

High-Precision Grinder Polisher - CMP Equipment for Wafer Grinding and Polishing in Semiconductor Labs

Product Name:High-Precision Semiconductor Grinder Polisher

Product Model: SUP-UNIPOL-300

Product Description: Grinding and Polishing Disc Diameter: Φ7 mm, Sample Holder Diameter: Φ30 mm. This equipment is primarily used for grinding small metallographic samples, especially suitable for the preparation of transmission electron microscope (TEM) samples. It can grind samples down to a thickness of 50 μm.

Product Introduction

The SUP-UNIPOL-300 small precision grinding and polishing machine is designed specifically for researchers in various laboratories. This compact automatic metallographic grinding and polishing machine is primarily used for grinding small metallographic samples, making it especially suitable for the preparation of transmission electron microscope (TEM) samples, with the ability to grind samples down to a thickness of 50 μm.

The SUP-UNIPOL-300 applies pressure to the sample being ground through a spring mechanism, allowing for adjustable pressure within a certain range, preventing damage to the sample due to excessive grinding pressure. The grinding speed can also be adjusted within a specific range, enabling the use of different speeds based on the type of sample. During the grinding process, the grinding time can be set, and the machine will automatically stop when the designated time is reached, allowing for unattended operation.

The SUP-UNIPOL-300 small precision grinding and polishing machine is capable of grinding a wide range of materials, including crystals, ceramics, glass, metals, rock samples, mineral samples, PCBs, infrared optical materials (such as zinc selenide, zinc sulfide, silicon, germanium crystals, etc.), refractory materials, composite materials, and polymers. It not only offers automatic grinding and polishing but also provides high precision and fast operation, making it a universal device for metallographic laboratories and electron microscopy labs both domestically and internationally.

Product Features

The machine mimics manual operation, with the lower plate stationary while the upper pressure rod drives the sample in a reciprocating "8" shape movement. Both the grinding pressure and speed are adjustable, making it easy to operate and suitable for unattended use.

Product Parameters

Product Name	High-Precision Grinder Polisher
Product Model	SUP-UNIPOL-300
Installation Conditions	1. Temperature and humidity: 10-85% RH (at 25 ℃ without condensation) Temperature: 0-45 ℃. 2. There are no strong seismic sources or corrosive gases around the equipment. 3. Power supply: Single phase: AC100-240V 50/60Hz National standard two pole socket 10A (the power supply voltage requirement is determined based on the input of the "power adapter") 4. Cooling water: no requirement for standard equipment 5. Air source: No requirement for standard equipment 6. Auxiliary equipment (purchased separately): Recommended: HEATER-3040 or 250 heating platform, SKCH-1 precision thickness gauge 7. Workbench: It is recommended to use it on a workbench or desktop with a load-bearing capacity of 50kg or more 8. Ventilation device: Good ventilation environment, no special ventilation device requirements required
Main Parameters	1. Equipment power supply port: DC24V 2.5A (standard "power adapter") 2. Total power: 25W 3. Research and sale disc diameter: Φ 70 mm 4. Sample tray diameter: Φ 30 mm 5. Number of workstations: 1 6. Spindle drive motor: DC24V 0.8A 10W 3000/60K=50rpm 7. Swing speed of sample tray: 0-160 times/minute (stepless speed regulation) 8. Sample Max diameter: Φ 30mm 9. Sample Max thickness ≤ 2mm 10. Control mode: timed operation (countdown)
Product Specification	Size: 400mm × 200mm × 230mm Net weight: approximately 11kg
Product Specification	Note: 1. Random standard "power adapter" specifications: IN: AC100-240V 50/60Hz OUT: DC-24V 2.5A, The actual power supply of the equipment shall be based on the label attached to the back of the product. 2. We can customize various research and development disks, special sample trays, fixtures, specialized components, etc. according to user requirements.