High Purity Titanium Carbonitride Alloy Sputtering Target (TiN/C)

High purity titanium carbonitride alloy target (TiN/C) plays a crucial role in semiconductor manufacturing, particularly in thin film deposition and device performance enhancement. Its excellent physical and chemical properties make it an ideal choice for fabricating high-performance electronic devices.

Note: Purity, shape, thickness, and dimensions can all be customized,Please feel free to contact us for more details.

Semiconductor Applications

1. Conductive Film Deposition  

   TiN/C alloy targets are commonly used to deposit conductive films, serving as electrode materials in electronic devices. Their superior conductivity and thermal stability make them excellent for high-frequency and high-temperature applications.

2. Interconnect Materials  

   In integrated circuits (ICs), TiN/C is used as a metal interconnect layer, providing low-resistance paths that ensure efficient signal transmission. Additionally, its corrosion resistance enhances stability during prolonged operation.

3. Insulating Layers  

   TiN is combined with oxide materials to form insulating layers that prevent short circuits and current leakage, improving the reliability and performance of devices.

4. Enhancing Device Performance  

   TiN/C targets can improve the switching speed and threshold voltage control of transistors, enhancing overall circuit performance, especially in high-performance computing and RF applications.

5. Anti-Reflective Coatings  

   In lithography processes, TiN/C can serve as an anti-reflective coating, reducing light reflection and improving exposure accuracy, thereby enhancing the quality of chip fabrication.

To receive a prompt quotation and expedited delivery, please provide complete target material specifications. This includes details on purity, dimensions, tolerance requirements, and any other technical specifications.

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