Premium Semiconductor Packaging Film De-taping Tape Release Peelable Film

Brand: Supsemi

Model: BR-350M0Y

Description:
1. Release film for semiconductor packaging such as QFN, BGA, and CSP.

2. Used for liquid compression molding release in high-power ceramic package LEDs and COB Mini LEDs.

The release film for packaging is made from ultra-high-quality fluoropolymers through a casting process. It features low surface energy, high melting point, high strength, and high elongation.

This packaging film is suitable for encapsulation in the semiconductor and LED industries, addressing issues such as knife marks, blemishes, and frame overflow on encapsulated products.

Product Parameters:

Model Num	BR-350M0Y	Tensile strength (MPa)	48
Substrate	ETFE	Elongation at break (%)	300
Substrate thickness (μm)	25/50/60/75	Continuous temperature resistance (°C)	160
Surface roughness (μm)	＜0.04	Flame retardant rating	V0

（Note: Before use, the mold should be thoroughly cleaned, and vacuum forming should be employed to ensure proper fit to the mold.）

Product Details:

1. Outstanding release properties for various material surfaces.

2. High tensile strength and elongation at elevated temperatures, enabling precise conformity with complex molds featuring significant height variations.

3. Melting point of 260°C, with long-term operational capability at 160°C.

4. Available in glossy and matte finishes to meet diverse surface requirements for final products.

5. Effectively addresses overflow issues during the plastic sealing process.

Product Applicability:

1. Release film for semiconductor packaging such as QFN, BGA, and CSP.

2. Used for liquid compression molding release in high-power ceramic package LEDs and COB Mini LEDs.

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