Wafer De-taping stripping Tape

Brand: Supsemi

Model: F914WT, E1-F921K

Description:
Wafer release tape is a type of tape made from a PET substrate. It features a release layer on the backside and a rubber adhesive layer on the front.

This tape has high peel strength, excellent adhesion to PE and PVC, and outstanding temperature resistance.

Wafer release tape is a type of tape made from a PET substrate. It features a release layer on the backside and a rubber adhesive layer on the front. This tape has high peel strength, excellent adhesion to PE and PVC, and outstanding temperature resistance.

It can be used for the removal of various silicon wafers, glass, and grinding tapes, as well as for the peeling of other temporary adhesive tapes.

Product Parameters:

Model	F914WT	E1-F921K
Material	PET	PET
Substrate thickness (μm)	50	38
total thickness (μm)	80	65
Glue	rubber	Acrylic
Surface resistance (ohms)	/	10^10
Peel strength	≥17	≥18
Temperature resistance	100℃*10min	room temperature
Color	transparent	gray transparent