QFN (Quad Flat No-lead) Package Type for Semiconductor Wafer Chips IC Protection

QFN packaging tape is a protective tape with excellent adhesion and high-temperature resistance, used for securing and protecting semiconductor chip packaging, with residue-free removal. The material and coating are uniform with high precision; 

it uses a PI substrate, offering excellent high-temperature properties and good thermal stability. No preheating is required during film application and removal; the tape leaves no residue after peeling. The product has high cleanliness, free of stains and impurities; it is ESD-safe, suitable for high-end applications.

 It is applied in the packaging process of semiconductor chips, such as QFN, to secure lead frames and prevent leakage of encapsulation materials. The tape provides high-temperature protection during electronic processing, serves for temporary fixation, masking, and precision protection for chips and films in various processes.

Product Features:

1. The material and coating are uniform with high precision;

2. It uses a PI substrate, offering excellent high-temperature properties and good thermal stability;

3. No preheating is required during film application and removal;

4. The tape leaves no residue after peeling;

5. The product has high cleanliness, free of stains and impurities;

6. It is ESD-safe, suitable for high-end applications.

Product Parameters:

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