Small Lab Plasma Cleaner for Semiconductor Surface Treatment

Small Lab Plasma Cleaner for Semiconductor Surface Treatment

Product Name: Small Lab Plasma Cleaner

Product Model: SUP-PCE-3

Product Description: The PCE-3 plasma cleaner features a heat-resistant glass chamber with dimensions Ø75mm × 165mm. It offers three adjustable output power levels: 6.8W, 10.5W, and 18W.

Equipped with a vacuum pump, it can evacuate the chamber while introducing protective gases such as argon, making it suitable for cleaning items that are prone to oxidation.

Product Description

1. The SUP-PCE-3 Plasma Cleaner features a heat-resistant glass chamber with dimensions Ø75mm × 165mm and offers three adjustable output power levels: 6.8W, 10.5W, and 18W.

2. This device primarily utilizes plasma generated from gases such as air, oxygen, or argon to remove oxide layers and contaminants from substrates. It can also modify surface properties (such as hydrophilicity and hydrophobicity), making it an ideal tool for substrate cleaning and film treatment.

3. Under the influence of RF power, the removal rate can reach up to 10nm/min. Pre-treating single crystal materials before epitaxial film growth significantly impacts the growth process.

4. The SUP-PCE-3 Plasma Cleaner is equipped with a vacuum pump that evacuates the chamber while introducing protective gases like argon, making it suitable for cleaning items that are prone to oxidation.

Product Features

1. Using an adjustable RF power supply, the device can be set to low, medium, or high power.

2. Tabletop unit, compact in structure, safe to operate, environmentally friendly, and cost-effective.

Product Parameters

Product Name	Small Lab Plasma Cleaner for Semiconductor Surface Treatment System
Product Model	SUP-PCE-3
Main Parameters	1. Input Voltage: 110V/220V, 50Hz/60Hz (please select in advance), less than 100W 2. RF Output Frequency: 13.56MHz 3. Plasma DC Power Settings: Low power setting—680V, 10mA, 6.8W; Medium power setting—700V, 15mA, 10.5W; High power setting—720V, 25mA, 18W 4. Plasma Chamber: Ø75mm × 165mm, heat-resistant glass, detachable front cover 5. Gas Inlet: Compatible with various gases such as N2, Ar, air, and mixed gases, primarily based on the properties of the materials being processed 6. Vacuum Pump and Valve Requirements: >160L/min, ultimate pressure 200mtorr (0.27mbar); optional digital vacuum gauge; needle valve to control gas flow; equipped with a three-way valve for quick control of gas intake, sealing the plasma chamber, and exhaust for cleaning and etching. Photo of Plasma and Vacuum Pump Note:Flammable gases are not allowed.
Product specifications	dimensions：200mm×250mm×210mm Weight: 8kg

Optional Accessories

Item No.

Product Name

Note

Resistance vacuum gauge (a low vacuum measurement instrument developed based on the thermal conductivity principle of the Pirani gauge, especially suitable for vacuum measurement in non-corrosive gas environments from atmospheric pressure to 0.1 Pa)

resistance vacuum gauge.jpg