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Spherical Pulsed Laser Deposition (PLD) System

Product Name: Spherical Pulsed Laser Deposition (PLD) System

Product Description: This system is a Spherical Pulsed Laser Deposition (PLD) development tool. Pulsed Laser Deposition (PLD) involves focusing a laser on a small area of the target material, using the high energy density of the laser to evaporate or even ionize a portion of the target material.

This allows the material to detach from the target and move toward the substrate, where it deposits to form a thin film.

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Product Description

Among the various thin film fabrication methods, Pulsed Laser Deposition (PLD) technology is widely used. It can be employed to prepare films of various materials, including metals, semiconductors, oxides, nitrides, carbides, borides, silicides, sulfides, and fluorides. It is also capable of synthesizing some difficult-to-produce materials, such as diamond and cubic boron nitride films.


Product Features

1. Ambient Temperature: 10℃ to 35℃  

2. Relative Humidity: No more than 75%  

3. Water Supply: Water pressure 0.2MPa to 0.4MPa, water temperature 15℃ to 25℃  

4. The surrounding environment of the equipment should be clean, with clean air, and should not contain dust or gases that could cause corrosion of electrical components or metal surfaces, or lead to electrical conductivity between metals.


Product Parameters

Product NameSpherical Pulsed Laser Deposition (PLD) System

Installation 

Requirements

1. Ambient Temperature: 10℃ to 35℃  

2. Relative Humidity: No more than 75%  

3. Power Supply: 220V, single-phase, 50±0.5 Hz  

4. Equipment Power: Less than 4KW  

5. Water Supply: Water pressure 0.2MPa to 0.4MPa, water temperature 15℃ to 25℃  

6. The surrounding environment of the equipment should be clean, with clean air, and should not contain dust or gases that could cause corrosion of electrical components or metal surfaces, or lead to electrical conductivity between metals.


Main 

Parameters


1. The system features a spherical structure for the vacuum chamber with a manual front-opening door.  

2. All components of the vacuum chamber and accompanying parts are made from high-quality stainless steel (304), argon arc welded, with a surface treated using glass bead blasting and electrochemical polishing.  

3. The effective size of the vacuum chamber is Φ300mm, equipped with a visible observation window.  

4. Ultimate Vacuum: ≤6.67 × 10^-5 Pa (achieved using a 600L/S molecular pump after outgassing, with an 8L/S backing pump);  

   - System vacuum leak rate: ≤5.0 × 10^-7 Pa·L/S;  

   - The system can achieve a vacuum of 8.0 × 10^-4 Pa from atmospheric pressure in 40 minutes; after stopping the pump for 12 hours, the vacuum level is ≤20 Pa.  

5. Sample Stage: Sample size φ40mm, rotation speed 1-20 RPM, with a distance between the substrate stage and the rotating target of 40 to 90mm.  

6. Maximum Sample Heating Temperature: 800℃, with temperature control accuracy of ±1°C, using a temperature control meter for regulation.  

7. Four-Position Rotating Target: Each target position is φ40mm, with a shutter exposing only one target position. The laser beam is required to strike the exposed target position. The rotating target has both orbital and rotational functions.  

8. The vacuum chamber is equipped with baking, lighting, and water pressure alarm devices.  

9. One mass flow controller (MFC) for gas inlet control: 0-100 SCCM.



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