UV Curing Machine Adhesive Remover for Semiconductor Lab

Product Description

The UV series adhesive remover is specifically designed for debonding products bonded with UV films, such as wafers, QFN, glass, substrates, mobile modules, and ceramics, after cutting. This series utilizes an LED cold light source and features an editable controller with a full-color touchscreen as the operating system, enhancing the stability of the equipment's performance and making operation convenient.

Product Features

1. Suitable for blue film, UV film, PET substrate film, and other single/double-layer films.  

2. Uses an LED cold light source, which is more stable and provides more uniform illumination compared to mercury lamp sources.  

3. The cold light source features 180° direct irradiation with a scanning method, gradually reducing the adhesion of the UV film to zero.  

4. Compact desktop system design occupies minimal space.  

5. Electrical components are from brands like Omron and Siemens, ensuring safe and reliable performance.  

6. Features a drawer-type mechanism; the LED light source is turned off when the drawer is opened.  

7. Equipped with a compact touchscreen, making cleaning parameters and error alarm information clear and easy to read.  

8. One-button start executes a fully automated workflow.  

9. The lifespan of the cold light source is ten times longer than that of typical mercury lamps, capable of continuous operation for over 6000 hours.  

10. The hinged cover is supported by hydraulic springs, making operation effortless and safe.

Product Parameters

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