Manual Wafer Laminator | Precision Wafer Film Applicator for Semiconductor Coating

Product Description

The TM series is specifically designed for the lamination process of wafers (slices), QFN, glass, substrates, and other materials before cutting. It is equipped with precision guide rails and an imported temperature control system, ensuring stable overall performance and convenient, quick operation.

Product Features

1. Suitable for blue film, UV film, PET substrate film, and other single/double-layer films.  

2. Compatible with the MODTF2 series frame.  

3. Anti-static Teflon-treated working plate effectively protects the chip.  

4. The working plate has a heating function, enhancing the adhesion of the film.  

5. The working plate height is elastic, accommodating products of different thicknesses.  

6. Roller pressure can be adjusted by regulating air pressure, ensuring constant control with numerical display.  

7. Equipped with a circular knife and a cross-cutting knife, using imported blades for longer lifespan.  

8. The hinged cover is supported by hydraulic springs, making operation effortless and safe.

Product Parameters

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