UV Curing Machine | UV Adhesive Remover | Professional UV Curing Equipment | Essential for Semiconductor Labs

Product Description

The UV-801 Adhesive Remover is specifically designed for the debonding of products bonded with UV films, such as wafers, QFN, glass, substrates, mobile modules, and ceramics. This series utilizes an LED cold light source and features an editable controller with a full-color touchscreen as the operating system, making the equipment more stable in performance and convenient to operate.

Product Features

1. UV LED Surface Light Source: Provides uniform, stable, and strong illumination, significantly shortening curing time and enhancing production efficiency.

2. Low Thermal Radiation: Particularly suitable for applications requiring heating, such as LCD edge sealing, plastic substrates, film printing, and medical devices.

3. Low Energy Consumption: Power consumption is only 10% of traditional mercury lamp curing machines, saving up to 90% on electricity.

4. Long Lifespan: LED lifespan exceeds 20,000 hours, reducing consumable costs.

5. Instant Use: No preheating required; ready to use with instant light intensity.

6. Safe and Environmentally Friendly: Contains no mercury and produces no ozone.

7. Customizable: UV LED surface light sources can be tailored to meet specific customer applications.

8. Compact Design: Desktop system design occupies minimal space.

Product Parameters

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