Welcome: Supsemi Electronic Technology Co., Ltd
sales@supsemi.com
+86-18059149998
The blue film laminator and wafer thinning and dicing laminator series is specifically designed for fast and efficient lamination processes for wafers, glass, LEDs, PCBs, and ceramics.
The machine features a unique film-saving design that significantly reduces lamination costs.
The blue film laminator and wafer thinning and dicing laminator series is specifically designed for fast and efficient lamination processes for wafers, glass, LEDs, PCBs, and ceramics. The machine features a unique film-saving design that significantly reduces lamination costs.
It is equipped with air-flexible pressure rollers and a platform design that allows for adjustable elasticity, accommodating products of varying thicknesses while minimizing lamination stress to prevent damage. It is user-friendly and can be operated immediately without the need for training.
Main Features:
1.Suitable for blue film, UV film, PET substrate film, and double-layer film.
2. Optional micro-hole lamination platform for ultra-thin wafers.
3. Heated and elastic lamination platform design adapts to different wafer thicknesses.
4. Unique adjustable pressure design for the lamination roller.
5. Equipped with circumferential and cross-cutting knives.
6. Optional ion blower static elimination device.
7. Compact and desktop-friendly design.
8. The manual laminator models: SUP-WAFER MOUNTER6 is suitable for wafers up to 6 inches;
SUP-WAFER MOUNTER8 is suitable for wafers up to 8 inches;
and SUP-WAFER MOUNTER12 is suitable for wafers up to 12 inches.
Film-Saving Manual Laminator:
The specially designed film-saving structure makes this series of manual laminators highly efficient, saving approximately 15% more film compared to standard manual laminators, significantly reducing customers' lamination costs. The cost-saving effect will be even more pronounced when using expensive UV films currently or in the future.
Micro-Hole Lamination Platform for Ultra-Thin Wafers (Optional):
The micro-hole design of the lamination platform, combined with a unique air flow design and elastic support structure, is suitable for wafers, glass, or ceramics with a minimum thickness of 100 microns. This structure, along with the air-flexible and adjustable pressure roller device, minimizes damage to ultra-thin wafers during lamination, significantly reducing the risk of breakage.
Heated and Elastic Anti-Static Teflon Surface Treatment Lamination Platform:
The platform features a heated design with an adjustable temperature range, ensuring optimal lamination adhesion. The elastic platform adapts to different thicknesses of wafers, glass, or ceramics. The anti-static Teflon treatment on the surface minimizes static electricity generated during lamination and effectively prevents physical scratches on chips.
This machine is equipped with an automatic film collection system, making it suitable for double-layer films with protective layers.
| Subject | Model | ||
| SUP-WAFER MOUNTER6 | SUP-WAFER MOUNTER8 | SUP-WAFER MOUNTER12 | |
| Compatible Wafer Sizes（inch） | 3-6 | 3-8 | 3-12 |
| Minimum Compatible Wafer Thickness (um) | Standard Platform: 150 µm; Micro-Hole Platform: 100 µm | ||
| Compatible Frame Size（inch） | 6 | 6/8 | 6/8/12 |
| Heating Temperature Range of the Platform (℃) | Room Temperature to 65°C | ||
| Component Replacement Time （min） | <10min | ||
| Dimensions of the Machine （mm） | 850（D）*390(W)*400(H) | 900（D）*450(W)*400(H) | 1000（D）*550(W)*400(H) |
| Power Supply Voltage (V) | 110-220 V | ||
| Pressure (Mpa) | 0.5~0.8 | ||
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Contact: Bruce Liu
WhatsApp: +86-18059149998
Tel: +86-18059149998
Email: sales@supsemi.com
Add: Room 1402, Building 1, No. 89 Xibeilu, Xishancun, Xibei Street, Xinluo District, Longyan City, Fujian Province
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