High-Precision Wafer Dicing Saw for 12-Inch Wafers QFN quartz etc

Product Name: High-Precision Wafer Dicing Saw for 12-Inch Wafers

Product Model: SYJ-3310

Product Description: Applicable to 12-inch silicon wafers, LED packaging, QFN, DNF, BGA, optical and optoelectronic devices, communication, PCB, ceramics, glass, lithium niobate, alumina, quartz, and more. Processing size: Φ12 or 280mm. Groove depth: ≦4mm or customizable.

Product Description

The UV series adhesive remover is specifically designed for debonding products bonded with UV films, such as wafers, QFN, glass, substrates, mobile modules, and ceramics, after cutting. This series utilizes an LED cold light source and features an editable controller with a full-color touchscreen as the operating system, enhancing the stability of the equipment's performance and making operation convenient.

Product Features

1. Large-size cutting processing, with a maximum processing size of φ12.

2. Equipped with imported air spindle and standard 2.4KW high-torque spindle.

3. Optional non-contact height measurement (NCS).

4. Optional blade breakage detection (BBD).

5. The θ-axis uses a direct-drive DD motor for high precision and fast speed.

6. Two sets of high and low magnification microscope systems enable high-speed image recognition, multiple alignment modes, and quick edge finding, significantly enhancing efficiency.

Product Parameters


Product Name	High-Precision Wafer Dicing Saw for 12-Inch Wafers QFN quartz etc
Product Model	SYJ-3310
Product Applications	12-inch silicon wafers, LED packaging, QFN, DNF, BGA, optical and optoelectronic devices, communication, PCB, ceramics, glass, lithium niobate, alumina, quartz.
Configuration Performance	Processing Size	Φ12 or 280mm
Configuration Performance	Groove Depth	≦4mm or customizable
Spindle	Speed	6000～60000rpm
Spindle	Output Power	DC, 2.4KW
X-axis	Cutting Stroke	MAX280mm
X-axis	Speed Setting Range	0.1～500mm/s
Y-axis	Cutting Stroke	Max280mm
	Single Step Accuracy	≦0.003mm/5mm
	Maximum Overall Error	≦0.005mm/280mm
Z-axis	Effective Stroke	Max40mm
	Repeatability Accuracy	0.001mm
	Tool Application Size	φ50mm～φ60mm
θ-axis	Angle Range	320°
θ-axis	Resolution	0.0002°
Alignment System	Light Source + Ring Light Industrial Camera
Display Monitor	Industrial-grade 15" Color LCD Touchscreen

Subject		Parameters
Operating System	Control System	PC Base+Windows
Operating System	Operating System	Windows Language: English / 中文 (Chinese)
Usage Conditions	Power Supply	Single-phase, AC 380±5%, 4.0kVY
	Compressed Air	Pressure: 0.5–0.6Mpa, Maximum Consumption: 260L/min
	Cutting Fluid	Pressure: 0.2–0.3Mpa, Maximum Consumption: 4.0L/min
	Cooling Water	Pressure: 0.2–0.3Mpa, Maximum Consumption: 1.5L/min
	Exhaust Volume	5.0m³/min (ANR)
	Ambient Temperature	20–25°C
	Humidity	<80%
	1. Please set the machine in an environment of 20-25°C (with fluctuations controlled within ±1°C); indoor humidity should be <80% and free from condensation. 2. Please use clean compressed air with an atmospheric pressure dew point below -15°C, residual oil content of 0.1ppm, and a filtration level of 0.01um/99.5 or higher. 3. Please control the temperature of the cutting fluid to room temperature +2°C (with fluctuations within ±1°C), and the cooling water temperature should match room temperature (with fluctuations controlled within ±1°C). 4. Please avoid subjecting the equipment to gravitational impacts or any external vibration threats. Additionally, do not place the equipment near blowers, ventilation openings, high-temperature devices, or sources of oil contamination. 5. Install the equipment on a waterproof floor and in a location with smooth drainage.
Installation Parameters	Overall Dimensions W × D × H	910mm×1100mm×1860mm
Installation Parameters	Weight	1500kg