Precision CNC Dicing Saw for Wafers, Crystals, Ceramics

Precision CNC Dicing Saw for Wafers, Crystals, Ceramics

Product Name: Precision CNC Dicing Saw: Wafers, Crystals, Ceramics & More

Product Model: SUP-SYJ-800

Product Description: The SUP-SYJ-800 CNC dicing saw is a continuous cutting machine employing three-dimensional computer control. The cutting process is programmed and controlled via computer software.

It's primarily used for dicing and grooving crystals, ceramics, glass, and various sheet-like materials. It can also cut a wide range of materials including crystals, ceramics, glass, ores, and metals.

Product Description

The SYJ-800 CNC dicing saw can process samples with a diameter up to 200mm and a cutting depth of up to 10mm. Driven by stepper motors, it achieves a cutting precision of 0.02mm. The sample stage features a vacuum chuck and allows for 360° rotation. The spindle speed is infinitely adjustable, enabling fast, smooth, and precise cutting. An external circulating water cooling system prevents overheating and potential damage to the sample during cutting. Different cutting blades can be selected depending on the sample material. A waterproof cover on the sample cutting stage prevents water splashing. The SYJ-800 is an ideal precision cutting machine for processing large crystal wafers in laboratory and production settings.

Product Features

1. Computer Control: The system utilizes computer control (MTICUT operating software running on Windows), allowing for custom program creation for cutting.

2. High-Torque Spindle Motor: The spindle is powered by a high-torque brushless AC motor with a speed of up to 3000 RPM, adjustable between 0-3000 RPM via a control knob.

3. Precision Rotary Stage: The rotary stage can be manually or automatically controlled for horizontal 360° rotation, with a rotational tolerance of ±0.02°. Operation is simple and convenient.

4. Large Vacuum Chuck: Equipped with an 8-inch precision vacuum chuck, the dicing saw can accommodate wafers up to 200 mm in diameter. A Ø220 mm sample platen is used during cutting, with a cutting travel of 200 mm x 200 mm.

5. Blade and Chuck Selection: Appropriate saw blades and chucks can be selected based on the dimensions and material of the samples.

Product Parameters

Product Name	Precision CNC Dicing Saw: Wafers, Crystals, Ceramics & More
Product Model	SUP-SYJ-800
Installation Requirements	1. Temperature and Humidity: 10-85% RH (at 25℃, no condensation); Temperature: 0-45℃. 2. No strong vibration sources or corrosive gases around the equipment. 3. Power Supply: AC110V 60Hz (NEMA three-prong plug for custom machines); AC220V 50Hz (standard three-prong plug). 4. Cooling Water: The equipment is equipped with inlet and outlet connections; users need to connect to a water supply and drainage system. 5. Air Supply: No air supply required for standard equipment. 6. Worktable: Dimensions 800mm × 600mm × 700mm, with a load capacity of over 50kg. 7. Ventilation: A good ventilation environment is required, with no special ventilation system needed.
Main Parameters	1. Power Supply Port: AC220V 50Hz 10A 2. Spindle Speed: 0-3000 RPM, infinitely adjustable 3. Spindle Driving Power: 180W 4. X-Axis Travel: 200mm 5. Y-Axis Travel: 200mm 6. Z-Axis Travel: 55mm 7. Maximum Dicing Depth: 1.3mm 8. Maximum Cutting Depth: 10mm 9. X/Y/Z Axis Drive Motor: High-precision stepper motor 10. Stepper Motor Positioning Accuracy: 0.01mm 11. Worktable Rotation Angle and Tolerance: 360° ±0.02° 12. Carrier Plate Diameter: Glass: φ220mm 13. Vacuum Chuck Diameter: φ203.2mm (8 inches) 14. Blade Size: Outer Diameter: Ø100/Ø150mm; Inner Diameter: Ø12.7mm 15. Main Control Method: Computer program (USB)
Rotation Speed Range	Max. 120°/min
Accuracy	0.01 mm position accuracy
Dicing Blades	Two diamond blades are included: One 4" Dia x 0.014"(0.35mm) (thickness) x 0.5" arbor fully sintered diamond blade (fig.1) One 6" Dia x 0.019"(0.5mm) (thickness) x 0.5" arbor impregnated diamond blade (fig.2) Two water splashing protectors are included. One for 4" blade and another one for 6" blade (fig. 3,4) Optional Extra Thin Blades are available at extra cost: 100 mm OD x 0.1 mm Thickness Diamond Cutting Blades with 0.5" Arbor Flange (fig. 5)
Product specifications	Dimensions: 700mm×530mm×710mm Weight: 55kg
Note	1. The standard power supply for the equipment in China is AC220V 50Hz; the actual power parameters are subject to the label attached to the back of the product. 2. This machine supports customized AC110V 60Hz power supply equipment. 3. A computer is required as the control host for this equipment, and the device comes with a USB flash drive containing the installation program.

Standard Accessories

Item No.	Product Name	Qty
1	Blade chuck pad	4 set
2	Glass sample platen	1 set
3	Resin ceramic block	2 set
4	Sintered diamond saw blade (Ø100mm × Ø12.7mm × 0.33mm)	1 set
5	Electroplated diamond saw blade (Ø100mm × Ø12.7mm × 0.4mm)	2 set
6	Sintered diamond dicing blade (Ø86mm × Ø70mm × 0.15mm)	1 set
7	Paraffin rod	4 set
8	Dicing blade chuck pad	1 set
9	Safety Goggles	1 set
10	Oil-free vacuum pump	1 set

Optional Accessories

Item No.	Product Name	Qty
1	Sintered Diamond Saw Blade Ø100mm × Ø12.7mm × 0.35mm 、 Ø76mm × Ø12.7mm × 0.23mm	Optional
2	Edge Sintered Diamond Saw Blade Ø100mm × Ø12.7mm × 0.4mm 、 Ø150mm × Ø12.7mm × 0.5mm	Optional
3	Sintered Diamond Dicing Blade Ø86mm × Ø70mm × 0.15mm	Optional
4	MTI Series Heating Platform	Optional

Precautions

1. It is recommended to use anti-corrosion coolant during cutting to prevent the lead screws from rusting.

2. After each use, please clean the machine, especially the lead screws with lubricant. Ensure that the X, Y, and Z axes can move freely without sticking or rusting.

Warranty Period

One year warranty with lifetime technical support.

Office Photo

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