The applications of Chemical Vapor Deposition (CVD) equipment are extensive, playing a crucial role in the preparation of protective coatings, crystal films, microelectronic material layers, optical materials, and more. Here are some key application areas:
1. Preparation of Protective Coatings
Many materials used in special environments require coatings for protection against wear, corrosion, high-temperature oxidation, and radiation. For example, films like TiN and TiC, produced via CVD, exhibit high hardness and wear resistance, effectively controlling wear during turning, milling, and drilling processes, particularly for turning inserts, milling cutters, scrapers, and solid drill bits. TiN has lower adhesion affinity compared to non-metallic coatings, offering superior resistance to adhesive wear and crescent wear compared to TiC coatings, making TiN coatings widely used on cutting tools. Additionally, films such as Al2O3 and TiN provide excellent corrosion resistance, while silicon-based compounds like SiC, Si3N4, and MaSi2 serve as significant high-temperature oxidation coatings. Furthermore, thermal barrier coatings developed from vacuum deposition technologies have become widely used in production, with ion-plated films of A1 and CuTi replacing conventional coatings on components in the aerospace industry.
2. Preparation of Optical Materials
In the optical field, diamond films are regarded as future optical materials due to their transparency across a wide wavelength range and exceptional resistance to thermal shock and radiation. They can be used as window materials for high-power lasers and dome materials for missiles and aerospace devices. Diamond films also serve as excellent UV-sensitive materials. Additionally, Shanghai Jiao Tong University has applied CVD diamond film preparation technology to drawing dies, overcoming key challenges related to uniform coating and adhesion, as well as addressing the international issue of diamond coating polishing.
3. Preparation of Microelectronic Material Layers
In the fundamental manufacturing processes of semiconductor devices and integrated circuits, steps such as epitaxy of semiconductor films, formation of P-N junctions, dielectric isolation, diffusion masks, and deposition of metal films are core processes. CVD has gradually replaced older methods like high-temperature oxidation and diffusion in the preparation of these material layers, dominating modern microelectronic technology. In ultra-large-scale integrated circuits, CVD is used to deposit polysilicon films, tungsten films, lead films, metal silicides, silicon oxide films, and silicon nitride films, which serve as gate electrodes, interlayer insulating films, metal interconnections, resistors, and heat dissipation materials.
4. Preparation of Superconducting Materials
The use of CVD technology for the preparation of superconducting materials was invented by the American Radio Corporation in the 1960s. The Nb3Sn low-temperature superconducting tape produced by CVD features a dense coating with controllable thickness and excellent mechanical properties, making it one of the best materials for fabricating high-field small magnets. To enhance the superconducting properties of Nb3Sn, extensive research has been conducted in various countries on doping, substrate materials, dehydrogenation, heat treatment, and copper stabilization, making CVD one of the primary production methods for Nb3Sn superconducting tapes.
5. Preparation of Solar Cells
The conversion of solar energy using inorganic materials to create solar cells is an important method for harnessing solar energy. Currently, CVD technology is widely used to manufacture polycrystalline silicon thin-film batteries. Successful trials have been conducted for silicon and gallium arsenide homojunction cells, as well as various heterojunction solar cells made from II-V and I-V group semiconductors, most of which are in thin-film form and predominantly utilize vapor deposition techniques.
6. Preparation of Crystals or Crystal Films
The demand for inorganic new materials has led to rapid advancements in crystal growth. CVD not only significantly improves the performance of certain crystals or crystal films but also enables the production of crystals that cannot be synthesized by other methods, making it one of the primary methods for producing inorganic new materials. One of the main applications is the deposition of epitaxial single crystal layers on specific single-crystal substrates. The earliest gas-phase epitaxy process involved silicon epitaxy, followed by the development of epitaxial compound semiconductor layers.
Supsemi offer professional CVD equipment that encompasses a variety of models and functions to meet the small-scale production and testing needs of laboratories and enterprises. Our equipment features a compact design, suitable for space-limited laboratory environments, making installation and operation convenient. It includes a sliding dual-furnace type, which significantly enhances sample processing efficiency, supporting quick sample replacement and cooling. Additionally, our infrared heating type ensures rapid heating and uniform temperature distribution, ideal for experiments with strict temperature requirements. We also provide a flanged gas mixing system that offers flexible gas supply options, ensuring precise control of gas flow.
Our CVD Furnaces are widely used in materials science, semiconductor processing, coating technology, and the development of optoelectronic materials, capable of meeting the demands for high-quality film deposition and material synthesis. Whether you are engaged in fundamental research or industrial applications, our equipment can provide you with reliable support. We invite you to contact us for more information and customized solutions, allowing us to help you achieve your research and production goals.
Contact: Bruce Liu
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