CuAl Aluminum Copper Alloy sputtering targets Customized

AlCu sputtering targets Product Details

Aluminum-copper AlCu sputtering targets are crucial materials for thin-film deposition, widely used in the semiconductor and microelectronics industries.  Their superior physicochemical properties make them ideal for metallization, electrode materials, and other thin-film applications.

Note: Purity, shape, thickness, and dimensions can all be customized,Please feel free to contact us for more details.

Physicochemical Properties:

1. Excellent Electrical Conductivity: Aluminum-copper alloys exhibit high electrical conductivity, ensuring efficient current transmission and meeting the demands of high-frequency and high-speed electronic devices. The conductivity varies with the alloy composition, generally exceeding that of pure aluminum.

2. Good Thermal Conductivity: Facilitates rapid heat dissipation, enhancing device reliability and stability, particularly crucial in high-power applications. Thermal conductivity is also composition-dependent.

3. Moderate Corrosion Resistance: Demonstrates acceptable corrosion resistance under specific conditions, but the level of corrosion resistance depends on the alloy composition and environmental factors.  Appropriate alloy ratios must be selected based on the specific application.

4. Good Mechanical Properties: Possesses sufficient strength and ductility to withstand the mechanical stresses of the sputtering process, ensuring target longevity.

5. Controllable Film Properties: By adjusting the aluminum-copper alloy composition, the resistivity, grain size, surface roughness, and other properties of the sputtered thin films can be precisely controlled to meet diverse application requirements.

Parameters:

Parameters for aluminum-copper sputtering targets vary depending on the manufacturer and specific application, but typically include:

1. Composition Ratio: The ratio of aluminum to copper affects physicochemical properties such as electrical and thermal conductivity and corrosion resistance. Common ratios include Al-Cu (90/10), Al-Cu (80/20), etc.

2. Purity: Target purity directly impacts film quality and performance, typically requiring high purity.

3. Size and Shape: Targets can be customized in various sizes and shapes (e.g., circular, rectangular) to meet application needs.

4. Thickness: Target thickness affects sputtering rate and lifespan.

5. Surface Roughness: Influences film quality; low surface roughness is generally preferred.

Main Applications of AlCu Sputtering Targets

1. Integrated Circuit Manufacturing: Used as metal interconnect layers to connect different parts of the chip, ensuring efficient signal transmission.

2. Semiconductor Devices: Employed as electrode materials in transistors, diodes, and other devices.

3. Thin-Film Solar Cells: Used in the fabrication of high-efficiency thin-film solar cells.

4. Other Electronic Devices: Used as conductive layers or electrode materials in various electronic devices.

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