Element Symbol:Aluminum Titanium (AlTi)
CAS:[N/A]
Model:Sup-AlTi
Purity:4N, 3N5, 3N
Shape:Round
Thickness:[N/A]
Dimension:[N/A]
(Note: Purity, shape, thickness, and dimensions can all be customized)
Titanium-aluminum targets are alloy materials made from titanium (Ti) and aluminum (Al), widely used in thin-film deposition technologies, particularly in Physical Vapor Deposition (PVD) and sputtering processes. Due to their excellent physical and chemical properties, titanium-aluminum targets find extensive applications in the semiconductor, optoelectronic, and other high-tech industries.
Note: Purity, shape, thickness, and dimensions can all be customized,Please feel free to contact us for more details.
Ti-75Al at% | Ti-70Al at% | Ti-67Al at% | Ti-60Al at% | Ti-50Al at% | Ti-30Al at% | Ti-20Al at% | Ti-14Al at% | |
Purity (%) | 99.7 | 99.7 | 99.7 | 99.7 | 99.8/99.9 | 99.9 | 99.9 | 99.9 |
Density (g/cm3) | 3.1 | 3.2 | 3.3 | 3.4 | 3.63/3.85 | 3.97 | 4.25 | 4.3 |
Grain Size (µm) | 100 | 100 | 100 | 100 | 100/- | - | - | - |
Process | HIP | HIP | HIP | HIP | HIP/VAR | VAR | VAR | VAR |
To receive a prompt quotation and expedited delivery, please provide complete target material specifications. This includes details on purity, dimensions, tolerance requirements, and any other technical specifications.
Main Characteristics
1. Density: The density of titanium-aluminum targets typically ranges from 3.5 to 4.5 g/cm³, depending on the ratio of titanium to aluminum.
2. Melting Point: The melting point of titanium is approximately 1668°C, while that of aluminum is around 660°C. The melting point of the titanium-aluminum alloy is between these two values.
3. Electrical Conductivity: Titanium-aluminum alloys exhibit good electrical conductivity, making them suitable for use in electronic devices.
4. Corrosion Resistance: Titanium possesses excellent corrosion resistance, allowing it to remain stable in various chemical environments.
5. Strength: Titanium-aluminum alloys have high strength, making them suitable for use in high-temperature and high-pressure environments.
Main Applications of Aluminum sputtering targets
1. Semiconductor Manufacturing: Used in the deposition of integrated circuits and thin-film transistors to enhance device performance.
2. Optoelectronic Devices: Applied in the fabrication of optical films and photodetectors to improve optical performance.
3. Aerospace: Utilized in the aerospace industry for manufacturing lightweight, high-strength components.
4. Medical Devices: Due to their biocompatibility, titanium-aluminum materials are suitable for medical implants.
5. Coating Technology: Used to produce wear-resistant and corrosion-resistant surface coatings, extending the lifespan of products.
Summary
Titanium-aluminum targets, with their excellent overall performance, have become indispensable materials in modern high-tech industries.
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Tel: +86-18059149998
Email: sales@supsemi.com
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