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High Purity Titanium Silicide TiSi Sputtering Target Customized

Element Symbol:Titanium Silicide (TiSi)
CAS:[N/A]
Model:Sup-TiSi
Purity:3N5, 3N,2N7
Shape:Round
Thickness:[N/A]
Dimension:[N/A]
(Note: Purity, shape, thickness, and dimensions can all be customized)

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Titanium silicide targets are alloy sputtering targets composed of titanium (Ti) and silicon (Si), primarily used in thin-film deposition processes, especially physical vapor deposition (PVD) and sputtering.  They combine the excellent conductivity and corrosion resistance of titanium with the semiconductor properties and thermal stability of silicon, making them a crucial material for thin-film applications in the semiconductor and related industries.

Note: Purity, shape, thickness, and dimensions can all be customized,Please feel free to contact us for more details.

Purity (%)ShapeManufacturing processMax. Size
99.9%, 99.95%, 99.7%

Plane target, Cylindrical target,

 Arc target, Custom-shaped target

Vacuum Melting,PMCustomized

To receive a prompt quotation and expedited delivery, please provide complete target material specifications. This includes details on purity, dimensions, tolerance requirements, and any other technical specifications.

Main Characteristics

- Composition: The composition ratio of titanium and silicon in titanium silicide targets can be adjusted depending on the specific application to achieve desired properties. Common titanium silicides include TiSi₂, Ti₅Si₃, and others.

Density: Density varies depending on the specific titanium silicide composition, typically ranging from 4-6 g/cm³.

Melting Point: The melting point also depends on the composition and is generally higher than the melting points of pure titanium and silicon.

Electrical Conductivity: Exhibits good electrical conductivity, although lower than pure titanium.

Thermal Stability: Possesses good thermal stability, capable of withstanding high-temperature processes.

Hardness: Relatively hard and wear-resistant.

Corrosion Resistance: Inherits some corrosion resistance from titanium, but the degree depends on the specific composition and environment.

Main Applications of Titanium sputtering targets

- Semiconductor Manufacturing: Used as interconnect layers, contact layers, and gate materials to improve the performance and reliability of integrated circuits.

Microelectronic Devices: Employed in the fabrication of various microelectronic devices, such as sensors, actuators, and memory devices.

Optoelectronic Devices: Used as electrode materials or functional layers in some optoelectronic devices.

Other Applications:  Also finds applications in specialized coatings and materials science research.TiSi Sputtering Target.jpg

TiSi Sputtering Target.jpg

TiSi Sputtering Target.jpg




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