High Purity Aluminum Silicon AlSi Alloy Sputtering Target Customized

Aluminum-silicon alloy targets are alloy sputtering targets composed of aluminum (Al) and silicon (Si), primarily used in thin-film deposition processes, especially physical vapor deposition (PVD) and sputtering. They combine the excellent conductivity of aluminum with the semiconductor properties and thermal stability of silicon, making them a crucial material for thin-film applications in the semiconductor and related industries. The aluminum-to-silicon ratio can be adjusted to optimize performance for specific applications.

Note: Purity, shape, thickness, and dimensions can all be customized,Please feel free to contact us for more details.

To receive a prompt quotation and expedited delivery, please provide complete target material specifications. This includes details on purity, dimensions, tolerance requirements, and any other technical specifications.

Main Characteristics

- Composition: The aluminum-silicon ratio in aluminum-silicon alloy targets is variable, typically with a higher aluminum content.

- Density: Density varies depending on the aluminum-silicon ratio, generally ranging from 2.7 to 2.9 g/cm³, slightly lower than pure aluminum.

- Melting Point: The melting point is lower than that of pure aluminum (660°C), with the exact value depending on the alloy composition.

- Electrical Conductivity: Exhibits good electrical conductivity, although lower than pure aluminum.

- Thermal Stability: Possesses good thermal stability, capable of withstanding high-temperature processes.

- Hardness: Slightly harder than pure aluminum.

- Corrosion Resistance: Corrosion resistance depends on the alloy composition and environment, generally slightly better than pure aluminum.

Main Applications of Titanium sputtering targets

- Semiconductor Manufacturing: Widely used in integrated circuit interconnect layers to improve conductivity and reliability. Also used in contact layers to ensure good electrical connection.

- Packaging Materials: Used as lead frames or other packaging materials in semiconductor packaging.

- Optoelectronic Devices: Used as electrode materials or functional layers in some optoelectronic devices.

- Other Applications: Also finds applications in specialized coatings and materials science research.

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