Heavy Precision Auto Lapping Grinder/Polisher Machine with 3 Stations

Heavy Precision Auto Lapping Grinder/Polisher Machine with 3 Stations

Product Model: Unipol-2002

Product Description: UNIPOL-2002: Precision grinding & polishing for large samples (up to Ø160mm). Three work stations, versatile for crystals, ceramics, metals, glass, & more. High-quality surface finish ensured by unique sample movement. Ideal for research & production.

Product Description

The UNIPOL-2002 precision grinding and polishing machine is equipped with three processing stations and is a floor-standing machine designed for the grinding and polishing of large-size samples. It is suitable for materials such as crystals, ceramics, metals, glass, rock samples, mineral samples, PCB plates, infrared optical materials (such as zinc selenide, zinc sulfide, silicon, germanium, etc.), refractories, composites, and more. This machine is one of the ideal polishing devices for scientific research and production experiments.

The machine features a Ø508mm grinding and polishing plate and three processing stations, capable of grinding and polishing circular samples up to Ø160mm or rectangular samples with a diagonal length of up to 160mm. During the grinding process, the three processing stations can oscillate left and right at a certain frequency while simultaneously moving the workpiece holder side to side. The workpiece holder rotates while orbiting around the grinding plate, allowing the sample to move in a random manner, which ensures uniform surface quality after grinding.

The three oscillating arms are equipped with their own drive motors, which enable the workpiece holder to rotate. The workpiece holder provided with the machine is a precision cylindrical metal block with high flatness and parallelism, ensuring that the surface of the ground sample also has high flatness and does not produce edge beveling. This feature is particularly suitable for samples with strict edge requirements.

With the appropriate accessories (such as the GPC series precision polishing control instrument), it can mass-produce high-quality flat polished products, such as the grinding and polishing of wafer samples with a diameter of ≤Ø160mm. The grinding process can utilize a grinding plate with abrasives or a polishing plate with sandpaper. The sandpaper or polishing pad is attached using magnetic suction, making installation and removal convenient. The choice between using sandpaper or abrasives for grinding can be made based on the material of the sample being polished.

Product Features

1. High-precision rotary chuck.

2. The spindle and the rotating plate are highly coaxial.

3. The spindle automatically lifts and lowers, facilitating polishing for multiple sizes; the spindle supports stepless speed adjustment.

4. Equipped with a timing polishing function for smarter polishing.

5. An optional automatic droplet dispenser is available for more convenient polishing.

Product Parameters

Parameters

1. Grinding plate: Diameter φ508mm (20 inches) (Standard configuration does not include grinding plate; please consult sales for specific materials).

2. Sample holder: Diameter φ160mm (6 inches), thickness 35mm.

3. Repair ring: Outer diameter φ196mm, inner diameter φ160.5mm, thickness 36mm.

4. Swing arm bracket: One set every 120°, a total of 3.

5. Number of workstations: 3.

6. Grinding plate speed: 10-90 revolutions per minute.

7. Swing arm bracket oscillation speed levels: 15-30 levels (Reference speed: 5.5-13.5 times per minute). The swing arm can be folded up for easy cleaning of the grinding plate and replacement of the sample holder.

8. Swing arm drive wheel speed: 30-90rpm.

9. Power of single motor for swing arm drive wheel: 25W.

10. Main motor of the grinding machine: Variable frequency motor: 1.25kW, 220V.

Specifications

11. Product Specifications:

- Size: Floor-standing, 820*1060*945mm

- Weight: 450kg

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