Element Symbol:Titanium Aluminum Zirconium (TiAlZr)
CAS:[N/A]
Model:Sup-TiAlZr
Purity:4N, 3N5, 3N
Shape:Round,Square
Thickness:[N/A]
Dimension:[N/A]
(Note: Purity, shape, thickness, and dimensions can all be customized)
TiAlZr Alloy Sputtering Target Description:
The TiAlZr alloy sputtering target is a high-performance target made from titanium, aluminum, and zirconium. It is widely used in Physical Vapor Deposition (PVD) technology. This alloy combines the excellent properties of all three metals, making it particularly suitable for thin film deposition applications that require high-temperature stability and corrosion resistance.
Note: Purity, shape, thickness, and dimensions can all be customized,Please feel free to contact us for more details.
Purity (%) | Shape | Manufacturing process | Max. Size |
99.95%, 99.9%, 99.7% | Plane target, Cylindrical target, Arc target, Custom-shaped target | Vacuum Melting,PM | Customized |
To receive a prompt quotation and expedited delivery, please provide complete target material specifications. This includes details on purity, dimensions, tolerance requirements, and any other technical specifications.
Physical and Chemical Properties
- Density: The density of the TiAlZr alloy falls between that of titanium (approximately 4.5 g/cm³) and aluminum (approximately 2.7 g/cm³), with the specific value depending on the composition ratio.
- Melting Point: The melting point is typically higher than that of aluminum (660 °C) but lower than that of titanium (1668 °C). The exact melting point needs to be determined experimentally based on the alloy composition.
- Hardness: This alloy sputtering target exhibits high hardness, superior to that of pure aluminum, due to the presence of titanium and zirconium.
- Thermal Conductivity: Thermal conductivity is influenced by the three elements, with aluminum's high thermal conductivity contributing positively to overall performance.
- Electrical Conductivity: The electrical conductivity of the alloy is a complex function of its composition and microstructure, with aluminum’s high conductivity enhancing the alloy's overall electrical performance.
- Oxidation and Corrosion Resistance: The formation of protective oxide layers enhances the alloy's oxidation and corrosion resistance, particularly in harsh environments.
Applications
The TiAlZr alloy sputtering target is widely used in the following areas:
1. Thin Film Deposition: Used for producing high-performance films suitable for electronic devices, optoelectronic devices, and more.
2. High-Temperature Applications: Ideal for situations requiring high thermal stability and oxidation resistance, such as high-temperature coatings and components.
3. Special Function Materials: The composition of titanium, aluminum, and zirconium can be adjusted to design materials with specific functions.
4. Biomedical Applications: Due to titanium's biocompatibility, this alloy can be used for biomedical implants or coatings.
Summary
The TiAlZr alloy sputtering target, with its superior physical and chemical properties, demonstrates broad application potential in the semiconductor field. As technology continues to advance, the range of applications for this alloy target is expected to expand further, supporting the development of high-performance materials.
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