High Purity Titanium Copper CuTi Alloy sputtering Target Customized

Titanium Copper Alloy Target Product Overview

The Titanium Copper Alloy Target is a high-performance target made from titanium and copper. It is widely used in Physical Vapor Deposition (PVD) technology. This alloy combines the strength of titanium with the excellent electrical conductivity of copper, making it particularly suitable for high-performance electronic devices and thin film deposition.

Note: Purity, shape, thickness, and dimensions can all be customized,Please feel free to contact us for more details.

To receive a prompt quotation and expedited delivery, please provide complete target material specifications. This includes details on purity, dimensions, tolerance requirements, and any other technical specifications.

Physical and Chemical Properties

- Density: The density of the titanium copper alloy falls between that of titanium (approximately 4.5 g/cm³) and copper (approximately 8.96 g/cm³), with the specific value depending on the composition ratio.

- Melting Point: The melting point is typically higher than that of pure copper (1085 °C), but it can vary based on composition, and the exact melting point needs to be determined experimentally.

- Hardness: The titanium copper alloy exhibits high hardness, superior to that of pure copper, making it suitable for high-wear environments.

- Electrical Conductivity: Although titanium has lower electrical conductivity, the high conductivity of copper in the alloy helps enhance overall electrical performance.

- Corrosion Resistance: The corrosion resistance of titanium improves the stability of the alloy in harsh environments, helping to extend its lifespan.

Applications

The titanium copper alloy target has various applications in the semiconductor field, including:

1. Metal Interconnects: Used as metal interconnect materials in integrated circuits, providing good electrical conductivity and mechanical strength.

2. Thin Film Deposition: Employed for producing conductive films suitable for various electronic and optoelectronic devices, meeting specific electrical and mechanical performance requirements.

3. High-Temperature Applications: Its high melting point and good thermal stability make it suitable for coatings and components in high-temperature environments.

4. Special Applications: Can be used to meet the requirements for specific electrical, thermal, or mechanical properties in advanced semiconductor devices.

Summary

The titanium copper alloy target, with its unique physical and chemical properties, demonstrates broad application potential in the semiconductor and electronics fields. As technology continues to advance, the range of applications for this alloy target is expected to expand further, supporting the development and manufacturing of high-performance materials.

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