High Purity AlSnCu Sputtering Target for PVD Thin Film Deposition

Aluminum Tin Copper Alloy Target is an important material widely used in physical vapor deposition (PVD) and other thin film deposition technologies. Due to its excellent physical and chemical properties, this alloy target plays a significant role in semiconductor and electronics manufacturing.

Note: Purity, shape, thickness, and dimensions can all be customized,Please feel free to contact us for more details.

### Physical and Chemical Properties

- Chemical Composition: Primarily composed of aluminum (Al), tin (Sn), and copper (Cu), with proportions adjustable according to application needs.

- Density: Approximately 2.7 g/cm³ (specific density may vary slightly based on alloy composition).

- Melting Point: Aluminum around 660°C (1220°F), tin around 232°C (450°F), and copper around 1085°C (1985°F).

- Electrical Conductivity: Aluminum and copper exhibit excellent conductivity, with aluminum having about 60% IACS (International Annealed Copper Standard) and copper about 100% IACS.

- Corrosion Resistance: The surface of aluminum alloys easily forms an oxide layer, enhancing corrosion resistance, while the addition of tin further improves the alloy's resistance to corrosion.

### Main Parameters

- Alloy Composition: Aluminum content typically ranges from 80% to 90%, with adjustable ratios of tin and copper based on specific application requirements.

- Mechanical Properties: Tensile strength can reach 200-300 MPa, demonstrating good ductility and workability.

- Hardness: Usually ranges from 70 to 90 HB (Brinell hardness).

### Applications in Semiconductors

1. Target Material  

   Used in the PVD process to deposit aluminum tin copper alloy films, providing good electrical conductivity and mechanical properties.

2. Interconnection Materials  

   Utilized for electrical interconnections in semiconductor devices to ensure low-resistance connections and enhance signal transmission efficiency.

3. Soldering Materials  

   Used in semiconductor packaging for soldering, with tin serving as the solder to connect chips to substrates.

4. Thermal Management  

   Employed in heat sinks and thermal plates to help dissipate heat effectively from semiconductor devices, extending their lifespan.

### Other Applications

1. Electronic Components  

   Used in interconnections and packaging of various electronic components.

2. LED Lighting  

   Serves as a heat dissipation structure for LED fixtures, improving thermal performance.

3. Battery Manufacturing  

   Utilized in battery connections and packaging materials to ensure good electrical contact.

4. Automation Equipment  

   Applied in automation and robotics for connection and conductive components, enhancing equipment performance.

5. Aerospace  

   Used to manufacture lightweight structural components, improving fuel efficiency in aircraft.

6. Medical Devices  

   Employed in medical instruments for conductive components, ensuring safety and reliability.

To receive a prompt quotation and expedited delivery, please provide complete target material specifications. This includes details on purity, dimensions, tolerance requirements, and any other technical specifications.

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