High Purity Manganese Copper MnCu Sputtering Target for PVD Thin Film Deposition

Manganese Copper MnCu Alloy Sputtering Target is an important material widely used in physical vapor deposition (PVD) and other thin film deposition technologies. Due to its excellent physical and chemical properties, this alloy target plays a significant role in semiconductor and electronics manufacturing.

Note: Purity, shape, thickness, and dimensions can all be customized,Please feel free to contact us for more details.

### Physical and Chemical Properties

- Chemical Composition: Primarily composed of copper (Cu) and manganese (Mn), with manganese content typically ranging from 1% to 10%.

- Density: Approximately 8.9 g/cm³ (specific density may vary slightly based on alloy composition).

- Melting Point: The melting point of copper is around 1085°C (1985°F), while manganese's melting point is about 1246°C (2275°F).

- Electrical Conductivity: Manganese copper alloy exhibits good electrical conductivity, though slightly lower than pure copper.

- Corrosion Resistance: The addition of manganese enhances the alloy's corrosion resistance, making it suitable for various environments.

### Main Parameters

- Alloy Composition: Copper content typically ranges from 90% to 99%, with manganese proportions adjustable based on specific application requirements.

- Mechanical Properties: Tensile strength can reach 300-450 MPa, demonstrating good ductility and workability.

- Hardness: Usually ranges from 80 to 100 HB (Brinell hardness).

### Applications in Semiconductors

1. Target Material  

   Used in the PVD process to deposit manganese copper alloy films, providing good electrical conductivity and mechanical properties.

2. Interconnection Materials  

   Utilized for electrical interconnections in semiconductor devices to ensure low-resistance connections and enhance signal transmission efficiency.

3. Soldering Materials  

   Used in semiconductor packaging for soldering, providing good connection performance.

4. Thermal Management  

   Employed in heat sinks and thermal plates to help dissipate heat effectively from semiconductor devices, extending their lifespan.

### Other Applications

1. Electronic Components  

   Used in interconnections and packaging of various electronic components.

2. Battery Manufacturing  

   Utilized in battery connections and packaging materials to ensure good electrical contact.

3. Automation Equipment  

   Applied in automation and robotics for connection and conductive components, enhancing equipment performance.

4. Aerospace  

   Used to manufacture lightweight structural components, improving fuel efficiency in aircraft.

5. Medical Devices  

   Employed in medical instruments for conductive components, ensuring safety and reliability.

To receive a prompt quotation and expedited delivery, please provide complete target material specifications. This includes details on purity, dimensions, tolerance requirements, and any other technical specifications.

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