High Purity Silver-Magnesium AgMg Sputtering Target for PVD Thin Film Deposition

AgMg alloy target (Silver-Magnesium Alloy Target) is an important material widely used in physical vapor deposition (PVD) and other thin film deposition technologies. Due to its excellent physical and chemical properties, the AgMg alloy sputtering target plays a significant role in semiconductor and electronic device manufacturing.

Note: Purity, shape, thickness, and dimensions can all be customized,Please feel free to contact us for more details.

### Physical and Chemical Properties

- Chemical Composition: Primarily composed of silver (Ag) and magnesium (Mg), with silver content typically ranging from 80% to 95%, and magnesium proportions adjusted according to specific needs.

- Density: Approximately 9.3 g/cm³ (specific density may vary slightly based on alloy composition).

- Melting Point: Silver has a melting point of about 961°C (1762°F), while magnesium melts at approximately 650°C (1202°F).

- Electrical Conductivity: Silver has excellent conductivity, and the alloy maintains relatively high conductivity suitable for electrical applications.

- Corrosion Resistance: Silver exhibits good corrosion resistance, and the addition of magnesium enhances the alloy's overall resistance to corrosion.

### Main Parameters

- Alloy Composition: Silver content typically between 80%-95%, with magnesium proportions adjustable based on specific application requirements.

- Mechanical Properties: Tensile strength can reach 300-400 MPa, exhibiting good ductility and workability.

- Hardness: Usually ranges from 60 to 80 HB (Brinell hardness).

### Applications in Semiconductors

1. Target Material  

   Used in the PVD process to deposit AgMg alloy films, providing good electrical conductivity and mechanical properties.

2. Interconnection Materials  

   Utilized for electrical interconnections in semiconductor devices, ensuring low-resistance connections and enhancing signal transmission efficiency.

3. Soldering Materials  

   Applied in semiconductor packaging for soldering, offering reliable connection performance.

4. Thermal Management  

   Used in heat sinks and thermal plates, helping to dissipate heat effectively from semiconductor devices and prolonging their lifespan.

### Other Applications

1. Electronic Components  

   Used in the interconnections and packaging of various electronic components.

2. Battery Manufacturing  

   Employed in battery connections and packaging materials to ensure good electrical contact.

3. Automation Equipment  

   Utilized in automation and robotics for connection and conductive components, improving equipment performance.

4. Aerospace  

   Used to manufacture lightweight structural components, enhancing fuel efficiency in aircraft.

5. Medical Devices  

   Applied in medical instruments for conductive components, ensuring safety and reliability.

To receive a prompt quotation and expedited delivery, please provide complete target material specifications. This includes details on purity, dimensions, tolerance requirements, and any other technical specifications.

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