High Purity SnAgCuTi Sputtering Target for PVD Thin Film Deposition

SnAgCuTi alloy target (Tin-Silver-Copper-Titanium Alloy Target) is an important material widely used in physical vapor deposition (PVD) and other thin film deposition technologies. Due to its excellent physical and chemical properties, the SnAgCuTi alloy target plays a significant role in semiconductor and electronic device manufacturing.

Note: Purity, shape, thickness, and dimensions can all be customized,Please feel free to contact us for more details.

### Physical and Chemical Properties

- Chemical Composition: Primarily composed of tin (Sn), silver (Ag), copper (Cu), and titanium (Ti), with tin content typically around 90%, and the proportions of silver, copper, and titanium adjusted according to specific needs.

- Density: Approximately 8.5 g/cm³ (specific density may vary slightly based on alloy composition).

- Melting Point: Tin has a melting point of about 232°C (450°F), silver about 961°C (1762°F), copper approximately 1085°C (1985°F), and titanium around 1668°C (3034°F).

- Electrical Conductivity: The alloy exhibits good electrical conductivity, making it suitable for electrical applications.

- Corrosion Resistance: The addition of titanium enhances the alloy's corrosion resistance, making it suitable for various environments.

### Main Parameters

- Alloy Composition: Tin content typically around 90%, with silver, copper, and titanium proportions adjustable based on specific application requirements.

- Mechanical Properties: Tensile strength can reach 350-450 MPa, exhibiting good ductility and workability.

- Hardness: Usually ranges from 60 to 90 HB (Brinell hardness).

### Applications in Semiconductors

1. Target Material  

   Used in the PVD process to deposit SnAgCuTi alloy films, providing good electrical conductivity and mechanical properties.

2. Soldering Materials  

   Used for soldering electronic devices, offering good connection performance and thermal conductivity.

3. Interconnection Materials  

   Utilized for electrical interconnections in semiconductor devices, ensuring low-resistance connections and enhancing signal transmission efficiency.

4. Thermal Management  

   Employed in heat sinks and thermal plates, helping to dissipate heat effectively from semiconductor devices and prolonging their lifespan.

### Other Applications

1. Electronic Components  

   Used in the interconnections and packaging of various electronic components.

2. Battery Manufacturing  

   Applied in battery connections and packaging materials to ensure good electrical contact.

3. Automation Equipment  

   Utilized in automation and robotics for connection and conductive components, improving equipment performance.

4. Aerospace  

   Used to manufacture lightweight structural components, enhancing fuel efficiency in aircraft.

5. Medical Devices  

   Applied in medical instruments for conductive components, ensuring safety and reliability.

To receive a prompt quotation and expedited delivery, please provide complete target material specifications. This includes details on purity, dimensions, tolerance requirements, and any other technical specifications.

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