High-Quality Wafer Cutting Protection Film Semiconductor Dicing Tape for Optimal Surface Protection

Brand: SupSemi

Model: PN-501E

Description: PN501E is a cohesive low-to-medium tack PO-based cutting protection film that features good initial tack. It can be used for cutting various devices and is easily peelable without leaving residue or burrs.

PN501E is a cohesive low-to-medium tack PO-based cutting protection film that features good initial tack. It can be used for cutting various devices and is easily peelable without leaving residue or burrs.

Prodcut Structure:

Wafer Cutting Protection Film Structure.png

Product Features:

1. Excellent weather resistance

2. Instant adhesion strength is good, with strong cohesion, and can be removed after cutting without leaving residue.

3. Complies with ROHS requirements.

Product Parameters:

Test project		eigenvalue	Test Method
Total thickness (excluding release film) (μ m)		170	micrometer
Thickness of basement membrane (μ m)		150	micrometer
appearance		Colorless and translucent	/
Adhesive layer thickness (μ m)		20	micrometer
180 ° peel force (gf/25mm) (304SUS)		295	GBT 2792-2014
180 ° peel force (gf/25mm) (SI sheet)		283
Tensile strength (MPa)	MD	28.2	GBT 30776-2014
	CD	29.0
Elongation rate (%)	MD	>500
	CD	>500
Transmittance (%)		88	Transmittance Meter

Storage Method：

Storage Conditions: Store in a dark, opaque environment at 10-30 ℃ with a relative humidity of 40-70%. The shelf life is 6 months.

Precautions：

1. The product should be kept away from heat sources and open flames.

2. The surface of the items to be adhered should be clean, dry, and free of grease or other contaminants.

3. The product is not suitable for outdoor use; avoid exposure to outdoor weather conditions that may affect the tape's performance and leave residue on the adhered surface.

Wafer Cutting Protection Film PN501E.jpg