UV Low Tack Tape Release Protective Type for Wafer

Brand: Supsemi

Model: SUP-PO-235

Description:1. Excellent weather resistance.

2. Instant adhesion strength is good; components are easily removable without residue after UV release.

3. Complies with ROHS requirements.

This series of products is made from a flexible PO film substrate coated with a special acrylic adhesive, providing good adhesion. After UV exposure, the tack is extremely low, and there is no residue.

Product Structure:

UV Low Tack Tape Structure.png

Product Application:

This product can be used for cutting and positioning protection of various silicon crystals, wafer, glass, ceramic capacitors, and PCB boards.

Product Features:

1. Excellent weather resistance.

2. Instant adhesion strength is good; components are easily removable without residue after UV release.

3. Complies with ROHS requirements.

Product Parameters:

Product model	base material	Substrate thickness (um)	Total thickness	Peel force/(gf/25mm)
Product model	base material	Substrate thickness (um)	Total thickness	Before UV	After UV
UV402DW	PO	80±3	90±5	700-1000	<7
UV390WR	PO	70±3	90±5	2000	<20
UV406F	PO	150±3	170±5	800	<15
UV391PY	PO	150±3	170±5	2500	<15
UV396US	PET	100±3	125±5	2000	<7