Copper-Zinc-Nickel-Aluminum CuZnNiAl Alloy Targets for thin-film Deposition

CuZnNiAl Targets Product Details

Copper-zinc-nickel-aluminum alloy sputtering targets are composed of copper (Cu), zinc (Zn), nickel (Ni), and aluminum (Al). They are widely used in thin-film deposition and materials research. This alloy combines the excellent electrical conductivity of copper, the corrosion resistance of zinc, the strength of nickel, and the lightweight properties of aluminum, making it valuable in electronic devices and other high-tech applications.

Note: Purity, shape, thickness, and dimensions can all be customized,Please feel free to contact us for more details.

CuZnNiAl Key Properties:

- Excellent Conductivity: The high conductivity of copper ensures superior performance in electrical applications.

- Corrosion Resistance: The addition of zinc enhances the alloy's corrosion resistance, making it suitable for harsh environments.

- Lightweight: The inclusion of aluminum reduces weight while maintaining strength.

- Outstanding Mechanical Properties: The presence of nickel increases the strength and toughness of the alloy, making it suitable for high-strength applications.

- Applications:

- Electronics Industry: Used for fabricating conductive layers and thin films in electronic components.

- Automotive Industry: Serves as a lightweight material to improve fuel efficiency and performance.

- Materials Science Research: Utilized in the development of new alloys and coating materials.

- Semiconductor Field:

  - Thin-Film Deposition: Copper-zinc-nickel-aluminum alloy targets are widely used in thin-film deposition for semiconductor devices, providing excellent conductivity and stability.

  - Electrode Materials: The alloy's superior characteristics enhance the performance and reliability of electrodes and conductive layers.

  - Doping Material: This alloy can be used as a doping material to improve the conductivity of semiconductor materials, enhancing device performance.

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