Cu Copper Backplate for thin-film Deposition

Copper Backplate Product Details

Copper backplates are crucial electronic components widely used in electronic and electrical devices, typically made from copper due to its high electrical and thermal conductivity. They play a key role in thin-film deposition, ion beam sputtering, and other high-tech applications.

Note: Purity, shape, thickness, and dimensions can all be customized,Please feel free to contact us for more details.

Copper Backplate Key Properties:

- Excellent Electrical Conductivity:

  - The high conductivity of copper allows the backplate to effectively conduct electricity, ensuring good electrical connections.

- Good Thermal Conductivity:

  - Copper's thermal conductivity enables rapid heat dissipation, protecting electronic components from overheating and enhancing device stability and performance.

- Mechanical Strength:

  - Copper backplates provide robust support, increasing the stability of the overall structure and making them suitable for heavy-load applications.

- Corrosion Resistance:

  - Treated copper backplates exhibit good corrosion resistance, making them suitable for use in various environments.

- Copper Backplate Applications:

- Electronic Devices:

  - In computers, servers, and other electronic devices, copper backplates support circuit boards, ensuring good electrical connections and heat dissipation.

- Power Management:

  - In power modules and converters, copper backplates help dissipate heat effectively, enhancing system efficiency and reliability.

- Communication Equipment:

  - In wireless communication and networking devices, copper backplates improve signal transmission stability and reliability.

- Target Applications:

  - In thin-film deposition and ion beam sputtering processes, copper backplates provide mechanical support and thermal management, ensuring the stability and performance of target materials.

Office Photo

Exhibition