SnAg Alloy sputtering target

SnAg sputtering targets Product Details

SnAg alloy targets are alloy targets composed of tin (Sn) and silver (Ag), primarily used in thin-film deposition techniques such as vacuum sputtering and magnetron sputtering to produce SnAg alloy films.  Their properties depend on the tin-to-silver ratio; common compositions include Sn96.5Ag3.5, Sn95.5Ag4.0, and Sn92.5Ag7.0. SnAg alloy targets combine the advantages of tin's low melting point and ease of sputtering with silver's high conductivity, high oxidation resistance, and good corrosion resistance. These characteristics make them widely used in the electronics industry, particularly in the semiconductor and microelectronics fields.

Note: Purity, shape, thickness, and dimensions can all be customized,Please feel free to contact us for more details.

SnAg Key Properties:

- Physical Properties: The physical properties of SnAg alloy targets are closely related to their composition ratio. For example, the melting point increases with increasing silver content but remains relatively low, facilitating control during the sputtering process. Density is also higher than pure tin, and hardness and strength increase with increasing silver content. Target size and shape can be customized to meet application requirements. Common shapes include circular and rectangular. The target surface usually requires fine processing to ensure uniformity and stability during the sputtering process.

- Chemical Properties: The chemical properties of SnAg alloy targets are closely related to their composition ratio. The addition of silver significantly improves the alloy's oxidation resistance and corrosion resistance, especially in relatively dry environments. However, corrosion resistance decreases in humid or corrosive environments. Appropriate protective measures are required during storage and transportation to prevent oxidation and corrosion.

- Mechanical Properties: The mechanical properties of SnAg alloy targets, such as strength, hardness, and toughness, depend on the alloy composition and fabrication process. By adjusting the tin-silver ratio, targets with varying strength, hardness, and toughness can be obtained to meet different sputtering process requirements. Higher silver content generally means higher strength and hardness but potentially lower toughness. The mechanical properties of the target directly affect its service life and stability during the sputtering process.

- Electrical Properties: SnAg alloy targets exhibit good electrical conductivity, although not as high as pure silver, but still superior to pure tin, and their conductivity is less affected by temperature. Resistivity varies with temperature and composition; higher silver content leads to better conductivity. Good electrical conductivity is a key factor in the application of SnAg alloy targets in the electronics field.

Main Applications of SnAg sputtering targets

    - Semiconductor Industry: Used to prepare SnAg alloy films as lead-free solder, conductive layers, and interconnect layers in processes such as chip packaging and wire bonding.

    - Microelectronics Industry: Used to prepare conductive layers and interconnects in various microelectronic devices to improve device reliability and performance.

    - Solar Cells: Used to prepare conductive layers in solar cells to improve the photovoltaic conversion efficiency.

    - Other Applications: Also find applications in other fields such as touch screens and flexible electronics.

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