High Purity Aluminum Niobium AlNb Alloy Sputtering Target

AlNb Target Product Details

Aluminum-niobium alloy targets are sputtering targets composed of aluminum (Al) and niobium (Nb), primarily used in thin-film deposition processes, especially physical vapor deposition (PVD) and sputtering. This alloy combines the excellent conductivity of aluminum with the high melting point and corrosion resistance of niobium, making it an important material for thin-film applications in the semiconductor and high-tech industries.

Note: Purity, shape, thickness, and dimensions can all be customized,Please feel free to contact us for more details.

AlNb Target Physical and Chemical Properties

- Composition: The ratio of aluminum to niobium can be adjusted based on specific application requirements for optimal performance.

- Density: Approximately 7.5 g/cm³, depending on the alloy composition.

- Melting Point: The melting point of aluminum is about 660°C, while niobium's is around 2468°C; the melting point of the alloy lies between these values.

- Electrical Conductivity: Exhibits good electrical conductivity, suitable for electronic devices.

- Corrosion Resistance: The alloy shows good stability in various chemical environments due to niobium's corrosion-resistant properties.

- Strength: Aluminum-niobium alloy has high strength, making it suitable for high-temperature and high-pressure applications.

Applications of AlNb Target

- Semiconductor Manufacturing: Used in the deposition of thin films for high-performance semiconductor devices, such as electrodes and interconnect layers.

- High-Temperature Applications: Suitable for environments requiring high temperature and corrosion resistance, such as certain high-power electronic devices.

- Optical Devices: Used to produce thin films with specific optical properties.

- Microelectromechanical Systems (MEMS): Employed in the fabrication of precise structures and functional layers.

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