High Vacuum Magnetron Sputtering System for Versatile Thin Film Deposition

Product Name: High Vacuum Magnetron Sputtering System for Versatile Thin Film Deposition

Product Model: VTC-600G

Product Description: The VTC-600G high vacuum magnetron sputtering system is a newly developed coating device that can be used to prepare single-layer or multi-layer ferroelectric films, conductive films, alloy films, semiconductor films, ceramic films, dielectric films, optical films, oxide films, hard films, and polytetrafluoroethylene (PTFE) films.

Product Description

The VTC-600G high vacuum Magnetron Sputtering System can be equipped with multiple target guns, with a matching RF power supply for sputtering non-conductive target materials and a DC power supply for sputtering conductive materials. Compared to similar devices, it not only has a wide range of applications but also features a compact design for easy operation. It is an ideal device for preparing material films in laboratories, particularly suitable for research on solid-state electrolytes and OLEDs.

Product Features

1. Multiple target guns can be optionally equipped, with a matching RF power supply for sputtering non-conductive target materials and a DC power supply for sputtering conductive materials (target guns can be interchanged based on customer needs).

2. Capable of preparing various films with a wide range of applications.

3. Compact design for easy operation.

4. The entire system features a modular design, with a separate vacuum chamber, vacuum pump unit, and control power supply, allowing for adjustments based on user requirements.

5. Users can choose the power supply according to their actual needs; one power supply can control multiple target guns, or multiple power supplies can individually control each target gun.

Product Parameters

Product Name

High Vacuum Magnetron Sputtering System for Versatile Thin Film Deposition

Product Model

VTC-600G

Main

Parameters

1. Structure: Desktop front-opening design with a rear-mounted pumping system.

2. Ultimate Vacuum: 6.0 × 10^-5 Pa.

3. Leak Rate: 1h ≤ 0.5 Pa.

4. Pumping Time: Approximately 20 minutes from atmospheric pressure to 5.0 × 10^-3 Pa.

5. Pumping System: Mechanical pump + molecular pump.

6. Sample Stage: φ140mm, room temperature to 500℃, accuracy ±1℃ (temperature can be increased based on actual needs), adjustable rotation speed from 5rpm to 20rpm. Optional bias function available to achieve higher quality coatings based on customer requirements.

7. Gas Inlet System: Two mass flow meters (one for argon and one for nitrogen).

8. Angle between the target head and the sample stage axis: 34°.

9. Number of Target Heads: 3 (arranged at 120° angles to each other).

10. Target Gun Cooling Method: Water cooling.

11. Target Material Size: φ2″, thickness 0.1-5mm (thickness may vary depending on the material).

Product

specifications

Dimensions:

Main Unit Size: 700mm×852mm×1529mm