Single-Target Magnetron Sputtering System for Lab Efficient Thin Film Deposition

Single-Target Magnetron Sputtering System for Lab Efficient Thin Film Deposition

Product Name: Single-Target Magnetron Sputter Coater for Lab Efficient Thin Film Deposition

Product Model: VTC-16-1HD

Product Description: The VTC-16-1HD single-target magnetron sputtering system is a newly developed high vacuum coating device designed by our company.

It can be used to prepare single-layer or multi-layer ferroelectric films, conductive films, alloy films, semiconductor films, ceramic films, dielectric films, optical films, oxide films, hard films, and polytetrafluoroethylene (PTFE) films.

Product Description

The single-target Magnetron Sputtering System is equipped with one target gun, allowing for the choice between a strong magnetic target and a weak magnetic target. The weak magnetic target is used for sputtering non-magnetic materials, while the strong magnetic target is suitable for sputtering ferromagnetic materials.

Compared to similar devices, it has the advantages of a compact size for easy operation and a wide range of usable materials, making it an ideal device for preparing various types of material films in laboratories.

Product Features

1. One target gun, with a matching RF power supply for sputtering non-conductive target materials or a DC power supply for sputtering conductive materials.

2. The target head is positioned directly above the sample stage, making it easier to install brittle target materials and reducing the risk of contaminating the samples.

3. Capable of preparing various films with a wide range of applications.

4. Compact design for easy operation.

Product Parameters

Product Name

Single-Target Magnetron Sputtering System for Lab Efficient Thin Film Deposition

Product Model

VTC-16-1HD

Installation

Requirements

This equipment must be used under the following conditions: temperature 25°C ± 15°C and humidity 55% RH ± 10% RH.

1. Water: The equipment is equipped with a self-circulating cooling water system (use purified water or deionized water).

2. Electricity: AC 220V, 50Hz, with proper grounding required.

3. Gas: The chamber needs to be filled with argon gas (purity above 99.99%); an argon gas cylinder (with a Ø6mm double ferrule connector) and pressure regulator must be provided by the user.

4. Work Surface: Dimensions 1500mm × 600mm × 700mm, with a load capacity of over 200kg.

5. Ventilation: A ventilation system is required.

Main

Parameters

1. Power Supply Voltage: 220V, 50Hz

2. Power: 900W

3. Chamber Inner Diameter: φ164mm

4. Ultimate Vacuum: 9.0 × 10^-4 Pa

5. Sample Stage Heating Temperature: RT-500℃, accuracy ±1℃ (temperature can be increased based on actual needs)

6. Number of Target Guns: 1 (located beneath the vacuum chamber)

7. Target Gun Cooling Method: Water cooling

8. Target Material Size: φ2″, thickness 0.1-5mm (thickness may vary depending on the material)

9. Sample Stage: φ86mm

10. Sample Stage Rotation Speed: Adjustable from 1rpm to 20rpm

11. DC Sputtering Power: 500W; RF Sputtering Power: 300W

12. Lid Opening Method: Automatic lift-up cover

13. Working Gas: Inert gases such as Ar

14. Inlet Gas Path: Mass flow meter controlled gas inlet, adjustable from 1 to 100 SCCM

Product

specifications

Dimensions:

Main Unit Size: 750mm × 450mm × 1020mm

Vacuum Chamber Specifications: φ164 × 172mm

Weight: 100kg

Standard Accessories

Item No.	Product Name	Qty
1	DC Power Supply Control System	Optional
2	RF Power Supply Control System	1 set
3	Molecular Pump (imported from Germany or domestic with higher pumping speed)	1 set
4	Chiller	1 set
5	Cooling Water Tube (Ø6mm)	2 set

Optional Accessories

Item No.	Product Name	Qty
1	Various target materials such as gold, indium, silver, and platinum	Optional
2	Optional strong magnetic target for sputtering ferromagnetic materials	Optional
3	Film Thickness Measurement System	Optional